Produktdetails

Number of channels 8 Technology family F Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 24 IOH (max) (mA) -3 Supply current (max) (µA) 55000 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
Number of channels 8 Technology family F Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type Bipolar Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 24 IOH (max) (mA) -3 Supply current (max) (µA) 55000 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3 SOP (NS) 20 98.28 mm² 12.6 x 7.8 SSOP (DB) 20 56.16 mm² 7.2 x 7.8
  • Eight Latches in a Single Package
  • 3-State Bus-Driving True Outputs
  • Full Parallel Access for Loading
  • Buffered Control Inputs
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
  • Eight Latches in a Single Package
  • 3-State Bus-Driving True Outputs
  • Full Parallel Access for Loading
  • Buffered Control Inputs
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs

These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight latches of the ´F373 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs will follow the data (D) inputs. When the latch enable is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

A buffered output-enable () input can be used to place the eight outputs in either a normal
logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

The output-enable () input does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN74F373 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F373 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F373 is characterized for operation from 0°C to 70°C.

 

 

These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight latches of the ´F373 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs will follow the data (D) inputs. When the latch enable is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

A buffered output-enable () input can be used to place the eight outputs in either a normal
logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

The output-enable () input does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN74F373 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F373 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F373 is characterized for operation from 0°C to 70°C.

 

 

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Technische Dokumentation

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Typ Titel Datum
* Data sheet Octal Transparent D-Type Latches With 3-State Outputs datasheet (Rev. A) 01 Okt 1993
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dez 2022
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML
Gehäuse Pins Herunterladen
PDIP (N) 20 Optionen anzeigen
SOIC (DW) 20 Optionen anzeigen
SOP (NS) 20 Optionen anzeigen
SSOP (DB) 20 Optionen anzeigen

Bestellen & Qualität

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  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
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  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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  • Werksstandort
  • Montagestandort

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