ADC paralelo de 2,7 V a 5,25 V digital, 5 V analógico, 14 bits y 3 MSPS con referencia interna

Detalles del producto

Resolution (Bits) 14 Sample rate (max) (ksps) 3000 Number of input channels 1 Interface type Byte-Wide, Parallel Architecture SAR Input type Pseudo-Differential, Single-ended Rating Catalog Reference mode External, Internal Input voltage range (max) (V) 2.5 Input voltage range (min) (V) 0 Features Oscillator Operating temperature range (°C) -40 to 85 Power consumption (typ) (mW) 85 Analog supply voltage (min) (V) 4.75 Analog supply voltage (max) (V) 5.25 SNR (dB) 78.5 Digital supply (min) (V) 2.7 Digital supply (max) (V) 5.25
Resolution (Bits) 14 Sample rate (max) (ksps) 3000 Number of input channels 1 Interface type Byte-Wide, Parallel Architecture SAR Input type Pseudo-Differential, Single-ended Rating Catalog Reference mode External, Internal Input voltage range (max) (V) 2.5 Input voltage range (min) (V) 0 Features Oscillator Operating temperature range (°C) -40 to 85 Power consumption (typ) (mW) 85 Analog supply voltage (min) (V) 4.75 Analog supply voltage (max) (V) 5.25 SNR (dB) 78.5 Digital supply (min) (V) 2.7 Digital supply (max) (V) 5.25
TQFP (PFB) 48 81 mm² 9 x 9
  • 3 MHz Sample Rate, 14-Bit Resolution
  • Zero Latency
  • Unipolar, Pseudo Differential Input, Range:
    • 0 V to 2.5 V
  • High Speed Parallel Interface
  • 78 dB SNR and 88.5 dB THD at 3 MSPS
  • Power Dissipation 85 mW at 3 MSPS
  • Nap Mode (10 mW Power Dissipation)
  • Power Down (10 µW)
  • Internal Reference
  • Internal Reference Buffer
  • 8-/14-Bit Bus Transfer
  • 48-Pin TQFP Package
  • APPLICATIONS
    • Optical Networking (DWDM, MEMS Based Switching)
    • Spectrum Analyzers
    • High Speed Data Acquisition Systems
    • High Speed Close-Loop Systems
    • Telecommunication
    • Ultra-Sound Detection

  • 3 MHz Sample Rate, 14-Bit Resolution
  • Zero Latency
  • Unipolar, Pseudo Differential Input, Range:
    • 0 V to 2.5 V
  • High Speed Parallel Interface
  • 78 dB SNR and 88.5 dB THD at 3 MSPS
  • Power Dissipation 85 mW at 3 MSPS
  • Nap Mode (10 mW Power Dissipation)
  • Power Down (10 µW)
  • Internal Reference
  • Internal Reference Buffer
  • 8-/14-Bit Bus Transfer
  • 48-Pin TQFP Package
  • APPLICATIONS
    • Optical Networking (DWDM, MEMS Based Switching)
    • Spectrum Analyzers
    • High Speed Data Acquisition Systems
    • High Speed Close-Loop Systems
    • Telecommunication
    • Ultra-Sound Detection

The ADS7891 is a 14-bit 3-MSPS A-to-D converter with 2.5-V internal reference. The device includes a capacitor based SAR A/D converter with inherent sample and hold. The device offers a 14-bit parallel interface with an additional byte mode that provides easy interface with 8-bit processors. The device has a pseudo-differential input stage.

The –IN swing of ±200 mV is useful to compensate for ground voltage mismatch between the ADC and sensor and also to cancel common-mode noise. With nap mode enabled, the device operates at lower power when used at lower conversion rates. The device is available in a 48-pin TQFP package.

The ADS7891 is a 14-bit 3-MSPS A-to-D converter with 2.5-V internal reference. The device includes a capacitor based SAR A/D converter with inherent sample and hold. The device offers a 14-bit parallel interface with an additional byte mode that provides easy interface with 8-bit processors. The device has a pseudo-differential input stage.

The –IN swing of ±200 mV is useful to compensate for ground voltage mismatch between the ADC and sensor and also to cancel common-mode noise. With nap mode enabled, the device operates at lower power when used at lower conversion rates. The device is available in a 48-pin TQFP package.

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Documentación técnica

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* Data sheet ADS7891: 14-Bit, 3 MSPS Low-Power SAR ADC datasheet 11 nov 2003

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje