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SN74AUP1T58

ACTIVO

Traductor de tensión de alimentación única

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SN74AUP1T58

ACTIVO
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Detalles del producto

Technology family AUP1T Number of channels 1 Vout (min) (V) 2.3 Vout (max) (V) 3.6 Data rate (max) (Mbps) 200 IOH (max) (mA) -4 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 Features Over-voltage tolerant inputs, Partial power down (Ioff), Single supply, Voltage translation Input type Schmitt-Trigger Output type Balanced CMOS, Push-Pull Operating temperature range (°C) -40 to 85
Technology family AUP1T Number of channels 1 Vout (min) (V) 2.3 Vout (max) (V) 3.6 Data rate (max) (Mbps) 200 IOH (max) (mA) -4 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 Features Over-voltage tolerant inputs, Partial power down (Ioff), Single supply, Voltage translation Input type Schmitt-Trigger Output type Balanced CMOS, Push-Pull Operating temperature range (°C) -40 to 85
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001 DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Texas Instruments NanoStar™ Packages
  • Single-Supply Voltage Translator
  • 1.8 V to 3.3 V (at VCC = 3.3 V)
  • 2.5 V to 3.3 V (at VCC = 3.3 V)
  • 1.8 V to 2.5 V (at VCC = 2.5 V)
  • 3.3 V to 2.5 V (at VCC = 2.5 V
  • Nine Configurable Gate Logic Functions
  • Schmitt-Trigger Inputs Reject Input Noise and Provide Better
    Output Signal Integrity
  • Ioff Supports Partial-Power-Down Mode With Low
    Leakage Current (0.5 µA)
  • Very Low Static and Dynamic Power Consumption
  • Pb-Free Packages Available: SON (DRY or DSF), SOT-23 (DBV),
    SC-70 (DCK), and NanoStar WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Related Devices: SN74AUP1T57, SN74AUP1T97, and SN74AUP1T98

NanoStar is a trademark of Texas Instruments.
  • Available in the Texas Instruments NanoStar™ Packages
  • Single-Supply Voltage Translator
  • 1.8 V to 3.3 V (at VCC = 3.3 V)
  • 2.5 V to 3.3 V (at VCC = 3.3 V)
  • 1.8 V to 2.5 V (at VCC = 2.5 V)
  • 3.3 V to 2.5 V (at VCC = 2.5 V
  • Nine Configurable Gate Logic Functions
  • Schmitt-Trigger Inputs Reject Input Noise and Provide Better
    Output Signal Integrity
  • Ioff Supports Partial-Power-Down Mode With Low
    Leakage Current (0.5 µA)
  • Very Low Static and Dynamic Power Consumption
  • Pb-Free Packages Available: SON (DRY or DSF), SOT-23 (DBV),
    SC-70 (DCK), and NanoStar WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Related Devices: SN74AUP1T57, SN74AUP1T97, and SN74AUP1T98

NanoStar is a trademark of Texas Instruments.

AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T58 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.

The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

The SN74AUP1T58 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T58 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.

AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T58 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.

The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

The SN74AUP1T58 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T58 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet SN74AUP1T58 Single-Supply Voltage-Level Translator With Configurable Functions datasheet (Rev. H) 31 mar 2010
Application brief Understanding Schmitt Triggers (Rev. B) PDF | HTML 17 abr 2025
Selection guide Voltage Translation Buying Guide (Rev. A) 15 abr 2021

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación de lógico genérico para encapsulados DCK, DCT, DCU, DRL y DBV,de 5- a 8-pines

EVM flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV y entre 5 y 8 pines.
Guía del usuario: PDF
No disponible en TI.com
Placa de evaluación

5-8-NL-LOGIC-EVM — EVM genérico de lógica y traducción compatible con paquetes DPW, DQE, DRY, DSF, DTM, DTQ y DTT de 5

EVM genérico diseñado para admitir cualquier dispositivo lógico o de conversión que tenga un encapsulado DTT, DRY, DPW, DTM, DQE, DQM, DSF o DTQ. El diseño del tablero permite una evaluación flexible.

Guía del usuario: PDF | HTML
No disponible en TI.com
Modelo de simulación

SN74AUP1T58 IBIS Model

SCEM471.ZIP (24 KB) - IBIS Model
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFP) 6 Ultra Librarian
DSBGA (YZP) 6 Ultra Librarian
SOT-23 (DBV) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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