SN74LXC1T45-Q1

ACTIVO

Transceptor de bus de automoción de bit único y doble alimentación con cambio de nivel de tensión co

Detalles del producto

Bits (#) 1 Data rate (max) (Mbps) 420 Topology Push-Pull Direction control (typ) Direction-controlled Vin (min) (V) 1.1 Vin (max) (V) 5.5 Vout (min) (V) 1.1 Vout (max) (V) 5.5 Applications GPIO Features Integrated pulldown resistors, Partial power down (Ioff), Vcc disconnect, Vcc isolation Prop delay (ns) 11 Technology family LXC Supply current (max) (mA) 0.004 Rating Automotive Operating temperature range (°C) -40 to 125
Bits (#) 1 Data rate (max) (Mbps) 420 Topology Push-Pull Direction control (typ) Direction-controlled Vin (min) (V) 1.1 Vin (max) (V) 5.5 Vout (min) (V) 1.1 Vout (max) (V) 5.5 Applications GPIO Features Integrated pulldown resistors, Partial power down (Ioff), Vcc disconnect, Vcc isolation Prop delay (ns) 11 Technology family LXC Supply current (max) (mA) 0.004 Rating Automotive Operating temperature range (°C) -40 to 125
SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1
  • Fully configurable dual-rail design allows each port to operate from 1.1 V to 5.5 V
  • Robust, glitch-free power supply sequencing
  • Up to 420-Mbps support for 3.3 V to 5.0 V
  • Schmitt-trigger inputs allow for slow or noisy inputs
  • I/O’s with integrated dynamic pull-down resistors help reduce external component count
  • Control inputs with integrated static pull-down resistors allow for floating control inputs
  • High drive strength (up to 32 mA at 5 V)
  • Low power consumption
    • 3-µA maximum (25°C)
    • 6-µA maximum (–40°C to 125°C)
  • VCC isolation and Vcc disconnect (Ioff-float) feature
    • If either VCC supply is < 100 mV or disconnected, all I/O’s get pulled-down and then become high-impedance
  • Ioff supports partial-power-down mode operation
  • Compatible with LVC family level shifters
  • Control logic (DIR and OE) are referenced to VCCA
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 4000-V human-body model
    • 1000-V charged-device model
  • Fully configurable dual-rail design allows each port to operate from 1.1 V to 5.5 V
  • Robust, glitch-free power supply sequencing
  • Up to 420-Mbps support for 3.3 V to 5.0 V
  • Schmitt-trigger inputs allow for slow or noisy inputs
  • I/O’s with integrated dynamic pull-down resistors help reduce external component count
  • Control inputs with integrated static pull-down resistors allow for floating control inputs
  • High drive strength (up to 32 mA at 5 V)
  • Low power consumption
    • 3-µA maximum (25°C)
    • 6-µA maximum (–40°C to 125°C)
  • VCC isolation and Vcc disconnect (Ioff-float) feature
    • If either VCC supply is < 100 mV or disconnected, all I/O’s get pulled-down and then become high-impedance
  • Ioff supports partial-power-down mode operation
  • Compatible with LVC family level shifters
  • Control logic (DIR and OE) are referenced to VCCA
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 4000-V human-body model
    • 1000-V charged-device model

The SN74LXC1T45-Q1 is a 1-bit, dual-supply noninverting bidirectional voltage level translation device. The I/O pin A and control pin (DIR) are referenced to VCCA logic levels, and the I/O pin B are referenced to VCCB logic levels. The A pin is able to accept I/O voltages ranging from 1.1 V to 5.5 V, while the B pin can accept I/O voltages from 1.1 V to 5.5 V. A high on DIR allows data transmission from A to B and a low on DIR allows data transmission from B to A. See Device Functional Modes for a summary of the operation of the control logic.

The SN74LXC1T45-Q1 is a 1-bit, dual-supply noninverting bidirectional voltage level translation device. The I/O pin A and control pin (DIR) are referenced to VCCA logic levels, and the I/O pin B are referenced to VCCB logic levels. The A pin is able to accept I/O voltages ranging from 1.1 V to 5.5 V, while the B pin can accept I/O voltages from 1.1 V to 5.5 V. A high on DIR allows data transmission from A to B and a low on DIR allows data transmission from B to A. See Device Functional Modes for a summary of the operation of the control logic.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SN74LXC1T45-Q1 Automotive Single-Bit Dual-Supply Bus Transceiver With Configurable Level Shifting datasheet PDF | HTML 08 ago 2022
Application note Schematic Checklist - A Guide to Designing With Fixed or Direction Control Translators PDF | HTML 02 oct 2024
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 jul 2024
Application brief Enabling Next Generation ADAS Domain Controllers with Voltage Translation PDF | HTML 13 oct 2022
Application brief Enabling LED and LCD Indicators in Modern System Designs PDF | HTML 01 ago 2022

Diseño y desarrollo

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Placa de evaluación

AVCLVCDIRCNTRL-EVM — EVM genérico para dispositivo de traducción bidireccional controlado por dirección compatible con AV

El módulo de evaluación genérico está diseñado para admitir dispositivos de conversión controlados por dirección de semiconductor de óxido metálico complementario de baja tensión y AVC de uno, dos, cuatro y ocho canales. También es compatible con la retención de bus y los dispositivos de automoción (...)

Guía del usuario: PDF
Modelo de simulación

SN74LXC1T45 IBIS Model

SCEM790.ZIP (56 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOT-SC70 (DCK) 6 Ultra Librarian
USON (DRY) 6 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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