TS3USB221A

ACTIVO

Interruptor multiplexor/demultiplexor USB 2.0 de alta velocidad y 1:2 con activación única y protecc

Detalles del producto

Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 900 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 ESD HBM (typ) (kV) 7 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 3.5 CON (typ) (pF) 6 Off isolation (typ) (dB) -41 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 6000 Ron channel match (max) (Ω) 0.2 Turnoff time (disable) (max) (ns) 17 Turnon time (enable) (max) (ns) 10 Rating Catalog
Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 900 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 ESD HBM (typ) (kV) 7 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 3.5 CON (typ) (pF) 6 Off isolation (typ) (dB) -41 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 6000 Ron channel match (max) (Ω) 0.2 Turnoff time (disable) (max) (ns) 17 Turnon time (enable) (max) (ns) 10 Rating Catalog
UQFN (RSE) 10 3 mm² 2 x 1.5
  • VCC operation at 2.5V to 3.3V
  • VI/O accepts signals up to 5.5V
  • 1.8V compatible control-pin inputs
  • Low-power mode when OE is disabled (1µA)
  • RON = 6Ω maximum
  • ΔRON = 0.2Ω typical
  • CIO(ON) = 6pf typical
  • Low power consumption (30µA maximum)
  • High bandwidth (900MHz typical)
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD performance tested per JEDEC JS-001
    • 7000V human-body model
    • 1000V charged-device model (JEDEC JS-002)
  • ESD performance I/O to GND
    • 12kV human-body model
  • VCC operation at 2.5V to 3.3V
  • VI/O accepts signals up to 5.5V
  • 1.8V compatible control-pin inputs
  • Low-power mode when OE is disabled (1µA)
  • RON = 6Ω maximum
  • ΔRON = 0.2Ω typical
  • CIO(ON) = 6pf typical
  • Low power consumption (30µA maximum)
  • High bandwidth (900MHz typical)
  • Latch-up performance exceeds 100mA per JESD 78, Class II
  • ESD performance tested per JEDEC JS-001
    • 7000V human-body model
    • 1000V charged-device model (JEDEC JS-002)
  • ESD performance I/O to GND
    • 12kV human-body model

The TS3USB221A device is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The device also has a low power mode that can reduce the power consumption to 1µA for portable applications with a battery or limited power budget. The device is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).

The TS3USB221A device integrates ESD protection cells on all pins, is available in a tiny µQFN package (2mm × 1.5mm) and is characterized over the free air temperature range from –40°C to 85°C.

The TS3USB221A device is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The device also has a low power mode that can reduce the power consumption to 1µA for portable applications with a battery or limited power budget. The device is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).

The TS3USB221A device integrates ESD protection cells on all pins, is available in a tiny µQFN package (2mm × 1.5mm) and is characterized over the free air temperature range from –40°C to 85°C.

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Documentación técnica

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* Data sheet TS3USB221A ESD Protected, High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer and Demultiplexer Switch With Single Enable datasheet (Rev. C) PDF | HTML 16 oct 2024
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 31 jul 2024
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 jun 2018
White paper Selecting signal switches to enable IoT communication modules 20 mar 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TS3USB221EEVM — Módulo de evaluación TS3USB221E

The TS3USB221EEVM is an evaluation module for the Texas Instruments high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The USB221EEVM allows signals to pass with minimum edge and phase distortion, integrates IEC-level ESD protection cells on all pins, and also multiplexes (...)

Guía del usuario: PDF
Placa de evaluación

TS3USB221EVM — Módulo de evaluación TS3USB221

The TS3USB221EVM is an evaluation module for the Texas Instruments high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The USB221EVM allows signals to pass with minimum edge and phase distortion and also multiplexes differential signals from a common USB input to one of two (...)

Guía del usuario: PDF
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Pedidos y calidad

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  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
  • Lugar de ensamblaje

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