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TXG8041-Q1

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Automotriz, ±80 V, convertidores de nivel a tierra de dirección fija de 4bits, configuración 3/1<

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TXG8041-Q1

PRESENTACIÓN PRELIMINAR
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Detalles del producto

Rating Automotive Ground offset voltage (max) (V) 80 Bits (#) 4 Topology Push-Pull Applications GPIO, I2S, PCM, SPI Forward/reverse channels 3 forward / 1 reverse Isolation rating Functional Data rate (max) (Mbps) 250 Prop delay (ns) 5.9 CMTI (V/µs) 250 Technology family TXG Vin (min) (V) 1.71 Vin (max) (V) 5.5 Output type 3-State Vout (min) (V) 1.71 Vout (max) (V) 5.5 Current consumption per channel (1 Mbps) (typ) (mA) 3.3 Features AEC Q100, Partial power down (Ioff)
Rating Automotive Ground offset voltage (max) (V) 80 Bits (#) 4 Topology Push-Pull Applications GPIO, I2S, PCM, SPI Forward/reverse channels 3 forward / 1 reverse Isolation rating Functional Data rate (max) (Mbps) 250 Prop delay (ns) 5.9 CMTI (V/µs) 250 Technology family TXG Vin (min) (V) 1.71 Vin (max) (V) 5.5 Output type 3-State Vout (min) (V) 1.71 Vout (max) (V) 5.5 Current consumption per channel (1 Mbps) (typ) (mA) 3.3 Features AEC Q100, Partial power down (Ioff)
SOT-23-THN (DYY) 14 13.692 mm² 4.2 x 3.26 SSOP (DBQ) 16 29.4 mm² 4.9 x 6
  • Supports DC shifts up to ±80V
  • AC Noise Rejection of 140VPP up to 1MHz
  • CMTI of 250V/µs
  • Low Prop Delay (<5ns) and Ch-Ch Skew (0.35ns)
  • Greater than 250Mbps
  • Low power consumption (0.65mA per channel at 1Mbps, 1.8V)
  • Fully configurable dual-rail design allows each port to operate from 1.71V to 5.5V
  • 4, 2, 1 channel devices with multiple configurations will be available
  • Two device variants:
    • TXG8041-Q1: 3 forward, 1 reverse
    • TXG8042-Q1: 2 forward, 2 reverse
  • Supports VCC disconnect feature (I/Os are forced into high-Z)
  • Schmitt-trigger inputs allows for slow and noisy signals
  • Inputs with integrated static pull-down resistors prevent channels from floating
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100mA per JESD 78, class II
    • ESD protection exceeds JESD 22
    • 4000V human-body model
    • 500V charged-device model
  • Package options provided:
    • DYY (SOT-14)
    • DBQ (QSOP-16)
  • Supports DC shifts up to ±80V
  • AC Noise Rejection of 140VPP up to 1MHz
  • CMTI of 250V/µs
  • Low Prop Delay (<5ns) and Ch-Ch Skew (0.35ns)
  • Greater than 250Mbps
  • Low power consumption (0.65mA per channel at 1Mbps, 1.8V)
  • Fully configurable dual-rail design allows each port to operate from 1.71V to 5.5V
  • 4, 2, 1 channel devices with multiple configurations will be available
  • Two device variants:
    • TXG8041-Q1: 3 forward, 1 reverse
    • TXG8042-Q1: 2 forward, 2 reverse
  • Supports VCC disconnect feature (I/Os are forced into high-Z)
  • Schmitt-trigger inputs allows for slow and noisy signals
  • Inputs with integrated static pull-down resistors prevent channels from floating
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100mA per JESD 78, class II
    • ESD protection exceeds JESD 22
    • 4000V human-body model
    • 500V charged-device model
  • Package options provided:
    • DYY (SOT-14)
    • DBQ (QSOP-16)

The TXG804x-Q1 is a 4-bit, fixed direction, non-galvanic based voltage and ground-level translator that supports both logic-level shifting between 1.71V to 5.5V and ground-level shifting up to ±80V. Compared to traditional level shifters, the TXG804x-Q1 family solves the challenges of voltage translation across different ground levels. The Simplified Diagram shows a common use case where DC shift occurs between GNDA to GNDB due to parasitic resistance or capacitance.

VCCA is referenced to GNDA and VCCB is referenced to GNDB. Ax pins are referenced to VCCA logic level while Bx pins are referenced to VCCB logic levels. Both A port and B port accept voltages from 1.71V to 5.5V. This device includes two enable pins that place the respective outputs in a high-impedance state when the OE pin is connected to GND or left floating. In the event of input power or signal loss, the output is default low when OE is High (refer to ). The leakage between GNDA and GNDB is 70nA when VCC to GND is shorted.

The TXG804x-Q1 device helps improve noise immunity and power sequencing across different ground domains while providing low power consumption, latency, and channel-to-channel skew. TXG804x-Q1 supresses noise levels of 140PP up to 1MHz (Figure 7-4). This device supports multiple interfaces such as SPI, UART, GPIO, and I2S.

The TXG804x-Q1 is a 4-bit, fixed direction, non-galvanic based voltage and ground-level translator that supports both logic-level shifting between 1.71V to 5.5V and ground-level shifting up to ±80V. Compared to traditional level shifters, the TXG804x-Q1 family solves the challenges of voltage translation across different ground levels. The Simplified Diagram shows a common use case where DC shift occurs between GNDA to GNDB due to parasitic resistance or capacitance.

VCCA is referenced to GNDA and VCCB is referenced to GNDB. Ax pins are referenced to VCCA logic level while Bx pins are referenced to VCCB logic levels. Both A port and B port accept voltages from 1.71V to 5.5V. This device includes two enable pins that place the respective outputs in a high-impedance state when the OE pin is connected to GND or left floating. In the event of input power or signal loss, the output is default low when OE is High (refer to ). The leakage between GNDA and GNDB is 70nA when VCC to GND is shorted.

The TXG804x-Q1 device helps improve noise immunity and power sequencing across different ground domains while providing low power consumption, latency, and channel-to-channel skew. TXG804x-Q1 supresses noise levels of 140PP up to 1MHz (Figure 7-4). This device supports multiple interfaces such as SPI, UART, GPIO, and I2S.
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Documentación técnica

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* Data sheet TXG804x-Q1 4-bit , ± 80V Ground-Level Translator datasheet PDF | HTML 12 may 2025
Technical article Uneven grounds? Address offset challenges with novel ground-level translators (Rev. A) PDF | HTML 05 jun 2025
Application brief Not All Grounds Are 0V PDF | HTML 21 may 2025
Product overview TI's Latest Ground-Level Translators PDF | HTML 07 may 2025

Diseño y desarrollo

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Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación (EVM) 14-24-LOGIC-EVM está diseñado para admitir cualquier dispositivo lógico que se encuentre en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
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Placa de evaluación

TXG-4CH-EVM — Módulo de evaluación TXG para conversor de nivel de tierra de 4 canales

El TXG-4CH-EVM es un módulo de evaluación (EVM) que se utiliza para evaluar la familia de productos del conversor de nivel de tierra de 4 canales TXGx04x. El EVM admite múltiples opciones de paquetes, que incluyen DBQ de 16 pines, DYY de 14 pines y RUC de 14 pines. El EVM dispone de múltiples (...)
Guía del usuario: PDF | HTML
No disponible en TI.com
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOT-23-THN (DYY) 14 Ultra Librarian
SSOP (DBQ) 16 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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