AM3871CCYE100 アクティブ

• High-Performance Sitara™ ARM® Processors
• ARM Cortex®-A8 Core
  • ARMv7 Architecture
    • In-Order, Dual-Issue, Superscalar Processor Core
    • Neon™ Multimedia Architecture
    • Supports Integer and Floating Point
    • Jazelle® RCT Execution Environment
• ARM Cortex-A8 Memory Architecture
  • 32KB of Instruction and Data Caches
  • 512KB of L2 Cache
  • 64KB of RAM, 48KB of Boot ROM
• 128KB of On-Chip Memory Controller (OCMC) RAM
• Imaging Subsystem (ISS)
  • Camera Sensor Connection
    • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
  • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
  • Resizer
    • Resizing Image and Video From 1/16x to 8x
    • Generating Two Different Resizing Outputs Concurrently
• Media Controller
  • Controls the HDVPSS and ISS
• SGX530 3D Graphics Engine
  • Delivers up to 25 MPoly/sec
  • Universal Scalable Shader Engine (USSE™)
  • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
  • Advanced Geometry DMA-Driven Operation
  • Programmable HQ Image Anti-Aliasing
• Endianness
  • ARM Instructions and Data – Little Endian
• HD Video Processing Subsystem (HDVPSS)
  • Two 165-MHz, 2-channel HD Video Capture Modules
    • One 16- or 24-Bit Input or Dual 8-Bit SD Input Channels
    • One 8-, 16-, or 24-Bit Input and One 8-Bit Only Input Channels
  • Two 165-MHz HD Video Display Outputs
    • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
  • Composite or S-Video Analog Output
  • Macrovision® Support Available
  • Digital HDMI 1.3 Transmitter With Integrated PHY
  • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
  • Three Graphics Layers and Compositors
• Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
  • Supports up to DDR2-800 and DDR3-1066
  • Up to Eight x 8 Devices Comprise 2GB of the Total Address Space
  • Dynamic Memory Manager (DMM)
    • Programmable Multizone Memory Mapping and Interleaving
    • Enables Efficient 2D Block Accesses
    • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
    • Optimizes Interlaced Accesses
• General-Purpose Memory Controller (GPMC)
  • 8- or 16-Bit Multiplexed Address and Data Bus
  • 512MB of Address Space Divided Among up to 8 Chip Selects
  • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
  • Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit or 512-Byte Hardware ECC for NAND
  • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
• Enhanced Direct Memory Access (EDMA) Controller
  • Four Transfer Controllers
  • 64 Independent DMA Channels and 8 Independent QDMA Channels
• Dual-Port Ethernet (10/100/1000 Mbps) With Optional Switch
  • IEEE 802.3 Compliant (3.3-V I/O Only)
  • MII/RMII/GMII/RGMII Media Independent Interfaces
  • Management Data I/O (MDIO) Module
  • Reset Isolation
  • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
• Dual USB 2.0 Ports With Integrated PHYs
  • USB2.0 High- and Full-Speed Clients
  • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
  • Supports End-point 0–15
• One PCI-Express 2.0 Port With Integrated PHY
  • Single Port With One Lane at 5.0 GT/s
  • Configurable as Root Complex or End-point
• Eight 32-Bit General-Purpose Timers (Timer1–Timer8)
• One System Watchdog Timer (WDT0)
• Six Configurable UART/IrDA/CIR Modules
  • UART0 With Modem Control Signals
  • Supports up to 3.6864 Mbps UART0/1/2
  • Supports up to 12 Mbps UART3/4/5
  • SIR, MIR, FIR (4.0 MBAUD), and CIR
• Four Serial Peripheral Interfaces (SPIs) (up to
  48 MHz)
  • Each With Four Chip Selects
• Three MMC/SD/SDIO Serial Interfaces (up to
  48 MHz)
  • Three Supporting up to 1-, 4-, or 8-Bit Modes
• Dual Controller Area Network (DCAN) Modules
  • CAN Version 2 Part A, B
• Four Inter-Integrated Circuit (I²C Bus) Ports
• Six Multichannel Audio Serial Ports (McASPs)
  • Dual 10 Serializer Transmit and Receive Ports
  • Quad Four Serializer Transmit and Receive Ports
  • DIT-Capable For S/PDIF (All Ports)
• Multichannel Buffered Serial Port (McBSP)
  • Transmit and Receive Clocks up to 48 MHz
  • Two Clock Zones and Two Serial Data Pins
  • Supports TDM, I2S, and Similar Formats
• Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
  • Direct Interface to One Hard Disk Drive
  • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
  • Supports Port Multiplier and Command-Based Switching
• Real-Time Clock (RTC)
  • One-Time or Periodic Interrupt Generation
• Up to 128 General-Purpose I/O (GPIO) Pins
• One Spin Lock Module With up to 128 Hardware Semaphores
• One Mailbox Module With 12 Mailboxes
• On-Chip ARM ROM Bootloader (RBL)
• Power, Reset, and Clock Management
  • Multiple Independent Core Power Domains
  • Multiple Independent Core Voltage Domains
  • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
  • Clock Enable and Disable Control for Subsystems and Peripherals
• 32KB of Embedded Trace Buffer (ETB) and
  5-Pin Trace Interface for Debug
• IEEE 1149.1 (JTAG) Compatible
• 684-Pin Pb-Free BGA Package (CYE Suffix),
  0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
• 45-nm CMOS Technology
• 1.8- and 3.3-V Dual Voltage Buffers for General I/O

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