제품 상세 정보

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Power supply voltage - dual (V) +/-10, +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 8 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 40 Operating temperature range (°C) -55 to 125 Input/output continuous current (max) (A) 0.01 Rating Catalog Drain supply voltage (max) (V) 18 Supply voltage (max) (V) 18 Negative rail supply voltage (max) (V) 0
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Power supply voltage - dual (V) +/-10, +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 8 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 40 Operating temperature range (°C) -55 to 125 Input/output continuous current (max) (A) 0.01 Rating Catalog Drain supply voltage (max) (V) 18 Supply voltage (max) (V) 18 Negative rail supply voltage (max) (V) 0
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4
  • 15V digital or ±7.5V peak-to-peak switching
  • 125Ω typical on-state resistance for 15V operation
  • Switch on-state resistance matched to within 5Ω over 15V signal-input range
  • On-state resistance flat over full peak-to-peak signal range
  • High on or off output-voltage ratio: 80dB typical at fis = 10kHz, RL = 1kΩ
  • High degree of linearity: <0.5% distortion typical at fis = 1kHz, Vis = 5Vp-p VDD – VSS ≥ 10V, RL = 10kΩ
  • Extremely low off-state switch leakage, resulting in very low offset current and high effective off-state resistance: 10 pA typical at VDD – VSS = 10V, TA = 25°C
  • Extremely high control input impedance (control circuit isolated from signal circuit): 1012Ω typical
  • Low crosstalk between switches: –50dB typical at fis = 8MHz, RL = 1kΩ
  • Matched control-input to signal-output capacitance: reduces output signal transients
  • Frequency response, switch On = 40MHz typical
  • 100% tested for quiescent current at 20V
  • 5V, 10V, and 15V parametric ratings
  • 15V digital or ±7.5V peak-to-peak switching
  • 125Ω typical on-state resistance for 15V operation
  • Switch on-state resistance matched to within 5Ω over 15V signal-input range
  • On-state resistance flat over full peak-to-peak signal range
  • High on or off output-voltage ratio: 80dB typical at fis = 10kHz, RL = 1kΩ
  • High degree of linearity: <0.5% distortion typical at fis = 1kHz, Vis = 5Vp-p VDD – VSS ≥ 10V, RL = 10kΩ
  • Extremely low off-state switch leakage, resulting in very low offset current and high effective off-state resistance: 10 pA typical at VDD – VSS = 10V, TA = 25°C
  • Extremely high control input impedance (control circuit isolated from signal circuit): 1012Ω typical
  • Low crosstalk between switches: –50dB typical at fis = 8MHz, RL = 1kΩ
  • Matched control-input to signal-output capacitance: reduces output signal transients
  • Frequency response, switch On = 40MHz typical
  • 100% tested for quiescent current at 20V
  • 5V, 10V, and 15V parametric ratings

The CD4066B device is a quad bilateral switch intended for the transmission or multiplexing of analog or digital signals. It is pin-for-pin compatible with the CD4016B device, but exhibits a much lower on-state resistance. In addition, the on-state resistance is relatively constant over the full signal-input range.

The CD4066B device consists of four bilateral switches, each with independent controls. Wide operating supply of 3V to 18V allows for use in a broad array of applications. The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold applications, the CD4016B device is recommended.

The CD4066B device is a quad bilateral switch intended for the transmission or multiplexing of analog or digital signals. It is pin-for-pin compatible with the CD4016B device, but exhibits a much lower on-state resistance. In addition, the on-state resistance is relatively constant over the full signal-input range.

The CD4066B device consists of four bilateral switches, each with independent controls. Wide operating supply of 3V to 18V allows for use in a broad array of applications. The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold applications, the CD4016B device is recommended.

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비교 대상 장치와 유사한 기능
TMUX7612 활성 1.8V 로직을 지원하는 50V, 1.3Ω RON, 1:1(SPST) 4채널 정밀 멀티플렉서 Higher voltage range

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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10개 모두 보기
유형 직함 날짜
* Data sheet CD4066B CMOS Quad Bilateral Switch datasheet (Rev. J) PDF | HTML 2024/08/09
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022/06/02
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021/12/01
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 2001/12/03
Selection guide Logic Guide (Rev. AC) PDF | HTML 1994/06/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

EVM-LEADED1 보드를 사용하면 TI의 공통 리드가 있는 패키지를 브레드보드 방식으로 빠르게 테스트할 수 있습니다.  이 보드에는 TI의 D, DBQ, DCT, DCU, DDF, DGS, DGV 및 PW 표면 실장 패키지를 100mil DIP 헤더로 변환할 수 있는 풋프린트가 있습니다.     

사용 설명서: PDF
TI.com에서 구매 불가
패키지 CAD 기호, 풋프린트 및 3D 모델
PDIP (N) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian
SOP (NS) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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지원 및 교육

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