CSD95430
- Active current balancing between paralleled phases sharing a single PWM input
- Peak continuous current: 90-A
- System efficiency: > 95% at 30-A
- High-frequency operation: 1.25-MHz
- Diode emulation function to enable efficiency discontinuous conduction mode (DCM) operation
- Temperature compensated bi-directional current sense
- Analog temperature output
- Fault monitoring
- PWM signal compatible: 3.3 V and 5 V
- Tri-state PWM input
- Integrated bootstrap switch
- Optimized dead-time for shoot-through protection
- High-density industry common QFN 5-mm x 6-mm footprint
- Ultra-low inductance package
- System-optimized PCB footprint
- Thermally enhanced topside cooling
- RoHS compliant - lead-free terminal plating
- Halogen free
The CSD95430RRBNexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. This power stage features an active current balance feature which allows multiple power stages to be paralleled off a single PWM input. This enables phase multiplication for very high current applications without the need for a similarly high phase count controller. The active current balance ensures that the multiplied phases share current evenly so no significant derating of current capability is needed when paralleling phases.
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관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CSD95430RRB Synchronous Buck NexFET™ Smart Power Stage datasheet | PDF | HTML | 2022/12/20 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VQFN-CLIP (RRB) | 41 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치