LM70
- 0.25°C Temperature Resolution.
- Shutdown Mode Conserves Power Between Temperature Reading
- SPI and MICROWIRE Bus Interface
- VSSOP-8 and WSON-8 Packages Save Space
- UL Recognized Component
Key Specifications
- Supply Voltage 2.65V to 5.5V
- Supply Current
- Operating260 μA (typ)490 μA (max)
- Shutdown12 μA (typ)
- Temperature Accuracy
- −40°C to 85°C, ±2°C(max)
- −10°C to 65°C, +1.5/−2°C(max)
- −55°C to 125°C, +3/−2°C(max)
- −55°C to 150°C, +3.5/−2°C(max)
All trademarks are the property of their respective owners.
The LM70 is a temperature sensor, Delta-Sigma analog-to-digital converter with an SPI and MICROWIRE compatible interface available in WSON and VSSOP 8-pin packages. The host can query the LM70 at any time to read temperature. A shutdown mode decreases power consumption to less than 10 µA. This mode is useful in systems where low average power consumption is critical.
The LM70 has 10-bit plus sign temperature resolution (0.25°C per LSB) while operating over a temperature range of −55°C to +150°C.
The LM70's 2.65V to 5.5V supply voltage range, low supply current and simple SPI interface make it ideal for a wide range of applications. These include thermal management and protection applications in hard disk drives, printers, electronic test equipment, and office electronics.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor datasheet (Rev. G) | 2013/03/22 | |
Certificate | UL Report Vol1-Sec4 Description E232195 | 2018/08/09 | ||
Application note | AN-1256 Tiny Temperature Sensors for Portable Systems (Rev. A) | 2013/04/26 | ||
Application note | Tiny Temperature Sensors for Remote Systems | 2003/02/17 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LM70SW-LINUX — LM70용 Linux 드라이버
Linux Mainline Status
Available in Linux Main line: Yes
Available through git.ti.com: N/A
- lm70
- tmp121
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VSSOP (DGK) | 8 | Ultra Librarian |
WSON (NGK) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치