패키징 정보
| 패키지 | 핀 TSSOP (DGG) | 64 |
| 작동 온도 범위(°C) -40 to 85 |
| 패키지 수량 | 캐리어 2,000 | LARGE T&R |
SN65LVDS117의 주요 특징
- Two Line Receivers and Eight ('109) or Sixteen ('117) Line Drivers Meet or Exceed the Requirements of ANSI EIA/TIA-644 Standard
- Typical Data Signaling Rates to 400 Mbps or Clock Frequencies to 400 MHz
- Outputs Arranged in Pairs From Each Bank
- Enabling Logic Allows Individual Control of Each Driver Output Pair, Plus All Outputs
- Low-Voltage Differential Signaling With Typical Output Voltage of 350 mV and a 100-Ω Load
- Electrically Compatible With LVDS, PECL, LVPECL, LVTTL, LVCMOS, GTL, BTL, CTT, SSTL, or HSTL Outputs With External Termination Networks
- Propagation Delay Times < 4.5 ns
- Output Skew Less Than 550 ps Bank Skew Less Than150 ps Part-to-Part Skew Less Than 1.5 ns
- Total Power Dissipation Typically <500 mW With All Ports Enabled and at 200 MHz
- Driver Outputs or Receiver Input Equals High Impedance When Disabled or With VCC < 1.5 V
- Bus-Pin ESD Protection Exceeds 12 kV
- Packaged in Thin Shrink Small-Outline Package With 20-Mil Terminal Pitch
SN65LVDS117에 대한 설명
The SN65LVDS109 and SN65LVDS117 are configured as two identical banks, each bank having one differential line receiver connected to either four ('109) or eight ('117) differential line drivers. The outputs are arranged in pairs having one output from each of the two banks. Individual output enables are provided for each pair of outputs and an additional enable is provided for all outputs.
The line receivers and line drivers implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS, as specified in EIA/TIA-644, is a data signaling technique that offers low power, low noise emission, high noise immunity, and high switching speeds. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)
The intended application of these devices, and the LVDS signaling technique, is for point-to-point or point-to-multipoint (distributed simplex) baseband data transmission on controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of drivers integrated into the same silicon substrate, along with the low pulse skew of balanced signaling, provides extremely precise timing alignment of the signals being repeated from the inputs. This is particularly advantageous for implementing system clock and data distribution trees.
The SN65LVDS109 and SN65LVDS117 are characterized for operation from –40°C to 85°C.