SN74LS138
- Designed Specifically for High-Speed:
- Memory Decoders
- Data Transmission Systems
- 3 Enable Inputs to Simplify Cascading and/or Data Reception
- Schottky-Clamped for High Performance
These Schottky-clamped TTL MSI circuits are designed to be used in high-performance memory decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory are usually less than the typical access time of the memory. This means that the effective system delay introduced by the Schottky-clamped system decoder is negligible.
The 'LS138, SN54S138, and SN74S138A decode one of eight lines dependent on the conditions at the three binary select inputs and the three enable inputs. Two active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications.
All of these decoder/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its driving circuit. All inputs are clamped with high-performance Schottky diodes to suppress line-ringing and to simplify system design.
The SN54LS138 and SN54S138 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LS138 and SN74S138A are characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 3-Line To 8-Line Decoders/Demultiplexers datasheet | 1988/03/01 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
PDIP (N) | 16 | Ultra Librarian |
SOIC (D) | 16 | Ultra Librarian |
SOP (NS) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치