TMP139
- Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
- Exceeds JEDEC temperature accuracy specification:
- ±0.25°C typical
- ±0.5°C maximum (+75°C to +95°C)
- ±0.75°C maximum (–40°C to +125°C)
- Operating temperature range: –40°C to +125°C
- Low power consumption:
- 8.3-µA typical average quiescent current
- 4.0-µA typical standby current
- I/O power supply of 1 V
- Core power supply of 1.8 V
- Two wire serial bus interface (I 2C and I3C basic operation modes)
- Up to 12.5-MHz data transfer rate in I3C basic mode
- In Band Interrupt (IBI) for alerting host
- Parity error check function for host writes
- Packet error check function for host read and writes
- 11-bit resolution: 0.25°C (1 LSB)
- Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch
The TMP139 is a high-accuracy temperature sensor with an I 2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.
The TMP139 has a typical accuracy of ±0.25°C over the entire temperature range from –40°C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25°C.
The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 µA when performing conversions every 125 ms.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | TMP139 0.5°C Accuracy, JEDEC DDR5 Grade B, Digital Temperature Sensor With I2C and I3C Interface datasheet (Rev. C) | PDF | HTML | 2023. 5. 4 | |
| Application brief | Enhance Thermal Sensing Performance With I3C Bus | PDF | HTML | 2021. 12. 22 | ||
| 애플리케이션 노트 | TMP139 Breakout Board Overview | PDF | HTML | 2020. 12. 23 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YAH) | 6 | Ultra Librarian |