TMUX7221
- Latch-up immune
- Dual supply range: ±4.5 V to ±22 V
- Single supply range: 4.5 V to 44 V
- Low on-resistance: 2.1 Ω
- –40°C to +125°C operating temperature
- 1.8 V logic compatible
- Integrated pull-down resistor on logic pins
- Fail-safe logic
- Rail-to-rail operation
- Bidirectional operation
The TMUX722x are complementary metal-oxide semiconductor (CMOS) switches with latch-up immunity in a dual channel, 1:1 (SPST) configuration. These devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The TMUX722x supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from V SS to V DD.
The TMUX722x can be enabled or disabled by controlling the SEL pins, turning on signal path 1 (S1 to D1) or signal path 2 (S2 to D2). All logic control inputs support logic levels from 1.8 V to V DD, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-safe logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage. For more information, see .
The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMUX722x 44 V, Low-RON, 1:1 (SPST), 2-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. A) | PDF | HTML | 2023/09/20 |
Certificate | TMUX10DGSEVM EU RoHS Declaration of Conformity (DoC) | 2024/04/19 | ||
EVM User's guide | TMUX10DGS Evaluation Module User's Guide | PDF | HTML | 2024/04/09 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TMUX-10DGS-EVM — TMUX 10-DGS evaluation module
The TMUX-10DGS-EVM is used to evaluate the performance of the 10-pin DGS package. The evaluation module (EVM) comes with a pad to allow 10-pin DGS devices to be soldered. Additionally, test points on board are provided to allow for the flexibility to test for various signals.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
패키지 | 핀 | 다운로드 |
---|---|---|
VSSOP (DGS) | 10 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.