TX7364

활성

제품 상세 정보

Device type Transmitter Number of input channels 64 Active supply current (typ) (mA) 20 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
Device type Transmitter Number of input channels 64 Active supply current (typ) (mA) 20 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
FCCSP (ACP) 196 144 mm² (12 mm × 12 mm)
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 0.1 mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 26Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 10mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400 MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈2.5 us for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50 MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12 mm × 12 mm) with 0.8-mm pitch
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 0.1 mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 26Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 10mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400 MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈2.5 us for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50 MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12 mm × 12 mm) with 0.8-mm pitch

TX7364 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX7364 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter solution for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX7364 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX7364 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter solution for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

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추가 정보 요청

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기술 자료

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3개 모두 보기
상위 문서 유형 직함 형식 옵션 최신 영어 버전 다운로드 날짜
* 데이터 시트 TX7364 3-Level, 64-Channel Transmitter with On-Chip Beamformer, T/R Switch datasheet PDF | HTML 2024. 4. 29
애플리케이션 노트 An Overview of TI's Transmitter Products for Ultrasound Applications PDF | HTML 2025. 7. 8
애플리케이션 노트 Comparison Between TX7364 and TX7332 for 128-Channel Transmit, 64-Channel Receive PDF | HTML 2024. 10. 17

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TX7364EVM — TX7364 평가 모듈

TX7364EVM은 TX7364 장치와 그 기능을 평가합니다.
지원되는 제품 및 하드웨어
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
FCCSP (ACP) 196 Ultra Librarian

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