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74AC11000

現行

4 通道、2 輸入、3-V 至 5.5-V NAND 閘

立即訂購
產品規格表

74AC11000

現行
產品規格表 立即訂購

產品詳細資料

Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 85
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6
  • Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
  • EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process
  • 500-mA Typ Latch-Up Immunity at 125°C
  • Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N)

EPIC is a trademark of Texas Instruments.
  • Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
  • EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process
  • 500-mA Typ Latch-Up Immunity at 125°C
  • Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N)

EPIC is a trademark of Texas Instruments.

This device contains four independent 2-input NAND gates. It performs the Boolean function Y = A • B or
Y = A + B in positive logic.

The 74AC11000 is characterized for operation from -40°C to 85°C.

This device contains four independent 2-input NAND gates. It performs the Boolean function Y = A • B or
Y = A + B in positive logic.

The 74AC11000 is characterized for operation from -40°C to 85°C.

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* Data sheet 74AC11000 datasheet (Rev. B) 2005年 6月 2日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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