開發模組 (EVM) 的 GUI
SMART-DAC-EVM-GUI — Smart DAC and smart AFE evaluation module software
This GUI interfaces with the on board controller of the smart DAC and smart AFE EVM ecosystem.
產品規格表
AFE53902-Q1
- AEC-Q100 qualified for automotive applications:
- Temperature grade 1: –40°C to +125°C, T A
- Multislope thermal foldback
- 10-bit analog-to-digital converter (ADC) input
- Digital-to-analog converter (DAC) output
- 10-bit ( AFE53902-Q1)
- 8-bit ( AFE43902-Q1)
- Pulse Width Modulation (PWM) output with 7‑bit duty cycle
- Standalone operation from nonvolatile memory (NVM)
- Look-up table (LUT) based parameter configuration
- Piecewise-linearizer for thermistor
- Automatically detects I 2C or SPI
- 1.62-V V IH with V DD = 5.5 V
- VREF/MODE pin selects between programming and standalone modes
- User-programmable NVM
- Internal, external, or VDD reference
- Wide operating range
- Power supply: 1.8 V to 5.5 V
- Tiny package: 16-pin WQFN (3 mm × 3 mm)
The 10-bit AFE53902-Q1 and 8-bit AFE43902-Q1 devices ( AFEx3902-Q1) are dual-channel, smart analog front ends (AFE) targeted for multislope thermal foldback of LED lighting. The output of LED lights reduce with an increase in temperature. Multislope thermal foldback helps maintain a steady light output from LEDs, irrespective of temperature change, while limiting the LED temperature to programmed thresholds.
The AFEx3902-Q1 have an ADC for temperature input and a DAC or PWM generator as an output. These devices have an integrated state machine that is preprogrammed as a multislope thermal foldback controller. The AFEx3902-Q1 are an excellent choice for thermal foldback of automotive rear lights and headlights, as well as horticulture lights. The AFEx3902-Q1 work independently from the parameters programed into the NVM, and thus enable these smart AFEs for processor-less applications and design reuse. These devices also automatically detect I 2C or SPI, and have an internal reference.
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技術文件
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檢視所有 1 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | AFEx3902-Q1 Smart Analog Front End (AFE) for Multislope Thermal Foldback and LUT-Based Control With I2C and SPI datasheet | PDF | HTML | 2023年 6月 29日 |
設計與開發
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開發板
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使用指南: PDF
| 封裝 | 引腳 | 下載 |
|---|---|---|
| WQFN (RTE) | 16 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。