CSD97394Q4M

現行

CSD97394Q4M 同步降壓 NexFET™ 功率級

產品詳細資料

VDS (V) 30 Ploss current (A) 12
VDS (V) 30 Ploss current (A) 12
VSON-CLIP (DPC) 8 15.75 mm² 4.5 x 3.5
  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

The CSD97394Q4M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97394Q4M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
具備升級功能,可直接投入使用替代所比較的產品
CSD97376Q4M 現行 30 V 20 A SON 3.5 x 4.5 mm 同步降壓 NexFET ™功率級 Identical parts

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
類型 標題 日期
* Data sheet CSD97394Q4M Synchronous Buck NexFET Power Stage datasheet PDF | HTML 2015年 1月 21日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬型號

CSD97394Q4M PSpice Transient Model

SLPM274.ZIP (55 KB) - PSpice Model
模擬型號

CSD97394Q4M TINA-TI Reference Design

SLPM281.TSC (366 KB) - TINA-TI Reference Design
模擬型號

CSD97394Q4M TINA-TI Transient Spice Model

SLPM282.ZIP (50 KB) - TINA-TI Spice Model
封裝 引腳 下載
VSON-CLIP (DPC) 8 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片