DAC63004
- Programmable voltage or current outputs with flexible configuration:
- Voltage outputs:
- 1 LSB INL and DNL (10-bit)
- Gains of 1x, 1.5x, 2x, 3x, and 4x
- Current outputs:
- 1 LSB INL and DNL (8-bit)
- Unipolar and bipolar output range options from 25 µA to 250 µA
- Voltage outputs:
- 35-µA/channel IDD in voltage-output mode
- Programmable comparator mode for all channels
- High-impedance output when VDD is off
- High-impedance and resistive pulldown power-down modes
- 50-MHz SPI-compatible interface
- Automatically detected I2C, PMBus™, or SPI interface
- 1.62-V VIH with VDD = 5.5 V
- General-purpose input/output (GPIO) configurable as multiple functions
- Predefined waveform generation: sine wave, triangular, sawtooth
- User-programmable nonvolatile memory (NVM)
- Internal, external, or power-supply as reference
- Wide operating range:
- Power supply: 1.8 V to 5.5 V
- Temperature range: –40˚C to +125˚C
- Tiny package: 16-pin WQFN (3 mm × 3 mm)
The 12-bit DAC63004 and 10-bit DAC53004 ( DACx3004) are a pin-compatible family of ultra-low-power, quad-channel, buffered, voltage-output and current-output smart digital-to-analog converters (DACs). These DACx3004 support Hi-Z power-down mode and Hi-Z output during power-off condition. The DAC outputs provide a force-sense option for use as a programmable comparator and current sink. The multifunction GPIO, function generation, and NVM enable these smart DACs for processor-less applications and design reuse. These devices automatically detect I2C, PMBus, and SPI interfaces and contain an internal reference.
The feature set combined with the tiny package and ultra-low power make these smart DACs an excellent choice for applications such as land mobile radios, pulseoximeters, notebook PCs, and other battery-operated applications for biasing, calibration, and waveform generation.
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RTE) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。