DS90LV027AH
- −40°C to +125°C Operating Temperature Range
- >600-Mbps (300-MHz) Switching Rates
- 0.3-ns Typical Differential Skew
- 0.7-ns Maximum Differential Skew
- 3.3-V Power Supply Design
- Low power dissipation (46 mW at 3.3-V Static)
- Flow-Through Design Simplifies PCB Layout
- Power Off Protection (Outputs in High Impedance)
- Conforms to TIA/EIA-644 Standard
- 8-Pin SOIC Package Saves Space
The DS90LV027AH is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AH is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.
The device is in a 8-lead SOIC package. The DS90LV027AH has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AH can be paired with its companion dual line receiver, the DS90LV028AH, or with any of TI’s LVDS receivers, to provide a high-speed point-to-point LVDS interface.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS90LV027AH high temperature LVDS dual differential driver datasheet (Rev. B) | PDF | HTML | 2019年 1月 18日 |
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
| Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DS90LV027A-28AEVM — 二通道 LVDS 驅動器和接收器評估模組
DS90LVRA2 EVM 是一款專為德州儀器 DS90LV027A LVDS 雙差動驅動器及 DS90LV028A LVDS 雙差動線路接收器之性能與功能評估而設計的評估模組。使用者可運用此套件快速評估 DS90LV027A 和 DS90LV028A 支援的輸出波形特性和訊號完整性。接頭針腳可連接至 DS90LV027A 和 DS90LV028A 輸入及輸出，也便於連接至實驗室設備或使用者系統，以進行性能評估。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
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TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。