HD3SS3212-Q1
- AEC-Q100 Qualified for automotive applications
- Temperature grade 2: –40°C to +105°C, TA
- Provides MUX/DEMUX solution for USB Type-C™ ecosystem for USB 3.2 Gen 1 and Gen 2 data rates
- Compatible with MIPI DSI/CSI, FPD-Link III, LVDS, and PCIe Gen II, III
- Operates up to 10 Gbps
- Wide –3-dB Differential BW of over 8 GHz
- Excellent dynamic characteristics (at 5 GHz)
- Crosstalk = –28 dB
- Off isolation = –19 dB
- Insertion loss = –2 dB
- Return loss = –8 dB
- Bidirectional "Mux/De-Mux" differential switch
- Supports common mode voltage 0 V to 2 V
- Single supply voltage VCC of 3.3 V
- Available in automotive friendly QFN package
(2.5 mm x 4.5 mm at 0.5 mm pitch)
The HD3SS3212-Q1 is a high-speed bidirectional passive switch in mux or demux configurations. It is suited for USB Type-C™ application that supports USB 3.2 Gen 1 and Gen 2 data rates. The SEL control pin provides switching on differential channels between Port B or Port C to Port A.
The HD3SS3212-Q1 is a generic analog differential passive switch. It works for any high-speed interface application requiring a common mode voltage range of 0 V to 2 V and differential signaling with differential amplitude up to 1800 mVpp. Adaptive tracking ensures the channel remains unchanged for the entire common mode voltage range.
Excellent dynamic characteristics of the device allows high-speed switching, minimum attenuation to the signal eye diagram, and with little added jitter. It consumes less than 1.65 mW of power when operational. The OEn pin has a shutdown mode resulting in less than 0.02 µW.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | HD3SS3212-Q1 Two-Channel Differential 2:1/1:2 USB3.2 Mux/Demux datasheet (Rev. A) | PDF | HTML | 2019年 6月 26日 |
White paper | Multiplexing FPD-Link Serializer Deserializer (SerDes) (Rev. A) | PDF | HTML | 2024年 2月 23日 | |
EVM User's guide | HD3SS3212x EVM User's Guide | 2018年 8月 27日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
HD3SS3212EVM — 雙通道差動 2:1/1:2 10 Gbps 多工器/解多工器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-00987 — 具有 USB 3.0 資料支援的 CISPR 25 5 級 USB Type-C™ 連接埠參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RKS) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。