產品詳細資料

Output type Differential Rating Military Rail-to-rail No Operating temperature range (°C) to
Output type Differential Rating Military Rail-to-rail No Operating temperature range (°C) to
  • Ensured High Speed: 20nS max
  • Tight Delay Matching on Both Outputs
  • Complementary TTL Outputs
  • High Input Impedance
  • Low Speed Variation with Overdrive Variation
  • Fan-Out of 4
  • Low Input Offset Voltage
  • Series 74 TTL Compatible

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  • Ensured High Speed: 20nS max
  • Tight Delay Matching on Both Outputs
  • Complementary TTL Outputs
  • High Input Impedance
  • Low Speed Variation with Overdrive Variation
  • Fan-Out of 4
  • Low Input Offset Voltage
  • Series 74 TTL Compatible

All trademarks are the property of their respective owners.

The LM160 is a very high speed differential input, complementary TTL output voltage comparator with improved characteristics over the μA760/μA760C, for which it is a pin-for-pin replacement. The device has been optimized for greater speed, input impedance and fan-out, and lower input offset voltage. Typically delay varies only 3nS for overdrive variations of 5mV to 400mV.

Complementary outputs having minimum skew are provided. Applications involve high speed analog to digital convertors and zero-crossing detectors in disk file systems.

The LM160 is a very high speed differential input, complementary TTL output voltage comparator with improved characteristics over the μA760/μA760C, for which it is a pin-for-pin replacement. The device has been optimized for greater speed, input impedance and fan-out, and lower input offset voltage. Typically delay varies only 3nS for overdrive variations of 5mV to 400mV.

Complementary outputs having minimum skew are provided. Applications involve high speed analog to digital convertors and zero-crossing detectors in disk file systems.

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類型 標題 日期
* Data sheet LM160QML High Speed Differential Comparator datasheet (Rev. A) 2013年 3月 27日

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內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點