LM60-Q1
- AEC-Q100 Qualified for Automotive Applications
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
- Device HBM ESD Classification Level 2
- Calibrated Linear Scale Factor of 6.25 mV/°C
- Rated for Full −40°C to +125°C Range
- Suitable for Remote Applications
- Available in SOT-23 Packages
- Key Specifications
- Accuracy at 25°C: ±2°C and ±3°C (Maximum)
- Accuracy for −40°C to +125°C: ±4°C (Maximum)
- Accuracy for −25°C to +125°C: ±3°C (Maximum)
- Temperature Slope: 6.25 mV/°C
- Power-Supply Voltage Range: 2.7 V to 10 V
- Current Drain at 25°C: 110 µA (Maximum)
- Nonlinearity: ±0.8°C (Maximum)
- Output Impedance: 800 Ω (Maximum)
The LM60-Q1 device is a precision integrated-circuit temperature sensor that can sense a −40°C to +125°C temperature range while operating from a single 2.7-V supply. The output voltage of the device is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/°C) and has a DC offset of
424 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the device ranges from 174 mV to 1205 mV for a −40°C to +125°C temperature range. The device is calibrated to provide accuracies of ±2°C at room temperature and ±3°C over the full −25°C to +125°C temperature range.
The linear output of the device, 424-mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the quiescent current of the device is less than 110 µA, self-heating is limited to a very low 0.1°C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LM60-Q1 2.7-V, SOT-23 Temperature Sensor datasheet | PDF | HTML | 2017年 8月 21日 |
Functional safety information | LM60-Q1 Functional Safety FIT Rate and FMD | PDF | HTML | 2021年 12月 14日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBZ) | 3 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點