LM60
- Industry-Standard Sensor Gain/Offset:
- 6.25mV/°C, 424 mV at 0°C
- LM60B Temperature Accuracy:
- ±2°C (Max) at 25°C
- ±3°C (Max) over −25°C to +125°C (Legacy chip) and −40°C to +125°C (New chip)
- LM60C Temperature Accuracy:
- ±3°C (Max) at 25°C
- ±4°C (Max) over −40°C to +125°C
- Wide Supply Range: 2.7V to 10V
- Quiescent Current at 25°C: 110µA (Max/Legacy chip) and 70µA (Max/New chip)
- Available Package Options:
- SOT-23 (3-pin)
- TO-92 (3-pin, Straight Leads)
- TO-92 (3-pin, Formed Leads)
- Nonlinearity: ±0.8°C (Maximum)
- DC Output Impedance: 120Ω/800Ω (typ/Max)
- Suitable for Remote Applications
The LM60 device is a precision integrated-circuit temperature sensor that can sense a −40°C to +125°C temperature range while operating from a single 2.7V to 10V supply. The output voltage of the device is linearly proportional to Celsius (Centigrade) temperature (6.25mV/°C) and has a DC offset of 424mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the device ranges from 174mV to 1205mV for a −40°C to +125°C temperature range. The device is calibrated to provide accuracies of ±2°C at room temperature and ±3°C over the full −25°C to +125°C (for Legacy chip) or −40°C to +125°C (for New chip) temperature range.
The linear output of the device, 424mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the quiescent current of the device is less than 110µA (for Legacy chip) and 70µA (for New chip), self-heating is limited to a very low 0.1°C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because the inherent low power consumption allows the device to be powered directly from the output of many logic gates.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | LM60 2.7V, SOT-23 or TO-92 Temperature Sensor datasheet (Rev. G) | PDF | HTML | 2025/2/25 | ||
| 應用說明 | TO-92 Packing Options / Ordering Instructions (Rev. A) | 2010/6/23 | ||||
| 應用說明 | Tiny Temperature Sensors for Remote Systems | 2003/2/17 |
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT-23 (DBZ) | 3 | Ultra Librarian |
| TO-92 (LP) | 3 | Ultra Librarian |