LMZ35003
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - Wide Input Voltage Range from 7 V to 50 V
- Output Adjustable from 2.5 V to 15 V
- 65-V Surge Capability
- Efficiencies Up To 96%
- Adjustable Switching Frequency
(300 kHz to 1 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing and Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Pre-bias Output Start-up
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 14°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - For Design Help visit http://www.ti.com/LMZ35003
- Create a Custom Design Using the LMZ35003 With the WEBENCH® Power Designer
The LMZ35003 power module is an easy-to-use integrated power solution that combines a 2.5-A DC/DC converter with a shielded inductor and passives into a low profile, QFN package. This total power solution allows as few as five external components and eliminates the loop compensation and magnetics part selection process.
The small 9 mm × 11 mm × 2.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation capability. The LMZ35003 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LMZ35003 2.5-A Power Module With 7-V to 50-V Input QFN Package datasheet (Rev. B) | 2018年 4月 11日 | |
| Application note | Soldering Considerations for Power Modules (Rev. C) | PDF | HTML | 2024年 3月 14日 | |
| Selection guide | Innovative DC/DC Power Modules Selection Guide (Rev. D) | 2021年 10月 14日 | ||
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020年 3月 5日 | ||
| White paper | Simplify low EMI design with power modules | 2017年 11月 20日 | ||
| Application note | Working With QFN Power Modules (Rev. A) | 2017年 6月 8日 | ||
| Application note | Power Module MSL Ratings | 2017年 1月 20日 | ||
| Technical article | Industrial stack lights get smarter with LEDs | PDF | HTML | 2016年 8月 9日 | |
| Application note | LMZ35003 Protects Against 60-V Line Transients | 2015年 6月 18日 | ||
| Application note | LMZ35003 Parallel Operation | 2014年 5月 28日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| B1QFN (RKG) | 41 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。