LP339-N
- Ultra-low power supply current drain (60 µA)-independent of the supply voltage (75 µW/comparator at +5 VDC)
- Low input biasing current: 3 nA
- Low input offset current: ±0.5 nA
- Low input offset voltage: ±2 mV
- Input common-mode voltage includes ground
- Output voltage compatible with MOS and CMOS logic
- High output sink current capability (30 mA at VO=2 VDC)
- Supply Input protected against reverse voltages
The LP339 consists of four independent voltage comparators designed specifically to operate from a single power supply and draw typically 60 µA of power supply drain current over a wide range of power supply voltages. Operation from split supplies is also possible and the ultra-low power supply drain current is independent of the power supply voltage. These comparators also feature a common-mode range which includes ground, even when operated from a single supply.
Applications include limit comparators, simple analog-to-digital converters, pulse, square and time delay generators; VCO's; multivibrators; high voltage logic gates. The LP339 was specifically designed to interface with the CMOS logic family. The ultra-low supply current makes the LP339 valuable in battery powered applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LP339 Ultra-Low Power Quad Comparator datasheet (Rev. A) | 2004年 5月 10日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
More literature | Die D/S LP339 MWA Ultra-Low Power Quad Comparator | 2012年 9月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (N) | 14 | Ultra Librarian |
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。