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TLV1704-Q1
- Qualified for Automotive Applications
- AEC Q100-Qualified With the Following Results
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
- Device HBM ESD Classification Level 2 (TLV1701-Q1)
- Device HBM ESD Classification Level 1C (TLV1702-Q1,TLV1704-Q1)
- Device CDM ESD Classification Level C6
- Supply Range: 2.2 V to 36 V or ±1.1 V to ±18 V
- Low Quiescent Current: 55 µA per Comparator
- Input Common-Mode Range Includes Both Rails
- Low Propagation Delay: 560 ns
- Low Input Offset Voltage: 300 µV
- Open Collector Outputs:
- Up to 36 V Above Negative Supply Regardless of Supply Voltage
- Industrial Temperature Range: –40°C to +125°C
- Small Packages:
- Single: SOT23-5 and SC-70-5
- Dual: VSSOP-8
- Quad: TSSOP-14
The TLV1701-Q1 (Single), TLV1702-Q1 (Dual) and TLV1704-Q1 (Quad) devices offers a wide supply range, rail-to-rail inputs, low quiescent current, and low propagation delay. All these features come in industry-standard, extremely-small packages, making these devices the best general-purpose comparators available.
The open collector output offers the advantage of allowing the output to be pulled to any voltage rail up to 36 V above the negative power supply, regardless of the TLV170x-Q1 supply voltage.
The device is a microPower comparator. Low input offset voltage, low input bias currents, low supply current, and open-collector configuration make the TLV170x-Q1 device flexible enough to handle almost any application, from simple voltage detection to driving a single relay.
The device is specified for operation across the expanded industrial temperature range of –40°C to +125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV170x-Q1 2.2-V to 36-V, microPower Comparator datasheet (Rev. C) | PDF | HTML | 2017年 10月 24日 |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TLV170x and TLV170x-Q1 TINA-TI Reference Design and Macromodel (Rev. A)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
TSSOP (PW) | 14 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。