TLV342S
- 1.8V and 5V performance
- Low offset (A grade)
- 1.25mV maximum (25°C)
- 1.7mV maximum (–40°C to 125°C)
- Rail-to-rail output swing
- Wide common-mode input voltage range: –0.2V to (V+ – 0.5V)
- Input bias current: 1pA (typical)
- Input offset voltage: 0.3mV (typical)
- Low supply current: 70µA/channel
- Low shutdown current: 10pA (typical) per channel
- Gain bandwidth: 2.3MHz (typical)
- Slew rate: 0.9V/µs (typical)
- Turnon time from shutdown: 5µs (typical)
- Input referred voltage noise (at 10kHz): 20nV/√ Hz
- ESD protection exceeds JESD 22:
- 2000V Human-Body Model (HBM)
- 750V Charged-device model (CDM)
The TLV34xx devices are single and dual CMOS operational amplifiers, respectively, with low-voltage, low-power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias current of 1pA (typical) and an offset voltage of 0.3mV (typical). For applications requiring excellent dc precision, the A grade (TLV34xA) has a low offset voltage of 1.25mV (maximum) at 25°C.
These single-supply amplifiers are designed specifically for ultra-low-voltage (1.5V to 5V) operation, with a common-mode input voltage range that typically extends from –0.2V to 0.5V from the positive supply rail.
The TLV341 (single) and TLV342 (dual) in the RUG package also offer a shutdown (SHDN) pin that can be used to disable the device. In shutdown mode, the supply current is reduced to 45pA (typical). Offered in both the SOT-23 and smaller SC70 packages, the TLV341 is an excellent choice for the most space-constrained applications. The dual TLV342 is offered in the standard SOIC, VSSOP, and X2QFN packages.
An extended industrial temperature range from –40°C to 125°C makes the TLV34xx flexible for use in a wide variety of commercial and industrial applications.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TLV34xx Low-Voltage Rail-to-Rail Output CMOS Operational Amplifiers With Shutdown datasheet (Rev. E) | PDF | HTML | 2025/6/30 | ||
| 電子書 | The Signal e-book: A compendium of blog posts on op amp design topics | PDF | HTML | 2017/3/28 |
設計與開發
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SMALL-AMP-DIP-EVM — 適用於採用小尺寸封裝之運算放大器的評估模組
SMALL-AMP-DIP-EVM 提供快速簡易方式,與許多業界標準小型封裝進行介接,因而加速小型封裝運算放大器原型設計。SMALL-AMP-DIP-EVM 支援八個小型封裝選項,包括 DPW-5 (X2SON)、DSG-8 (WSON)、DCN-8 (SOT)、DDF-8 (SOT)、RUG-10 (X2QFN)、RUC-14 (X2QFN)、RGY-14 (VQFN) 和 RTE-16 (WQFN)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| X2QFN (RUG) | 10 | Ultra Librarian |