100-pin (PZP) package image

TMS320F28374SPZPT 現行

具 400 MIPS、1xCPU、1xCLA、FPU、TMU、512 KB 快閃記憶體、EMIF、12b ADC 的 C2000 ™ 32 位元 MCU

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:3A991A2

封裝資訊

封裝 | 引腳 HTQFP (PZP) | 100
作業溫度範圍 (°C) -40 to 105
包裝數量 | 運送包裝 90 | JEDEC TRAY (10+1)

TMS320F28374S 的特色

  • TMS320C28x 32-bit CPU
    • 200MHz
    • IEEE 754 single-precision Floating-Point Unit (FPU)
    • Trigonometric Math Unit (TMU)
    • Viterbi/Complex Math Unit (VCU-II)
  • Programmable Control Law Accelerator (CLA)
    • 200MHz
    • IEEE 754 single-precision floating-point instructions
    • Executes code independently of main CPU
  • On-chip memory
    • 512KB (256KW) or 1MB (512KW) of flash (ECC-protected)
    • 132KB (66KW) or 164KB (82KW) of RAM (ECC-protected or parity-protected)
    • Dual-zone security supporting third-party development
    • Unique identification number
  • Clock and system control
    • Two internal zero-pin 10MHz oscillators
    • On-chip crystal oscillator
    • Windowed watchdog timer module
    • Missing clock detection circuitry
  • 1.2V core, 3.3V I/O design
  • System peripherals
    • Two External Memory Interfaces (EMIFs) with ASRAM and SDRAM support
    • 6-channel Direct Memory Access (DMA) controller
    • Up to 169 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins with input filtering
    • Expanded Peripheral Interrupt controller (ePIE)
    • Multiple Low-Power Mode (LPM) support with external wakeup
  • Communications peripherals
    • USB 2.0 (MAC + PHY)
    • Support for 12-pin 3.3V-compatible Universal Parallel Port (uPP) interface
    • Two Controller Area Network (CAN) modules (pin-bootable)
    • Three high-speed (up to 50MHz) SPI ports (pin-bootable)
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • Four Serial Communications Interfaces (SCI/UART) (pin-bootable)
    • Two I2C interfaces (pin-bootable)
  • Analog subsystem
    • Up to four Analog-to-Digital Converters (ADCs)
      • 16-bit mode
        • 1.1MSPS each (up to 4.4MSPS system throughput)
        • Differential inputs
        • Up to 12 external channels
      • 12-bit mode
        • 3.5MSPS each (up to 14MSPS system throughput)
        • Single-ended inputs
        • Up to 24 external channels
      • Single Sample-and-Hold (S/H) on each ADC
      • Hardware-integrated post-processing of ADC conversions
        • Saturating offset calibration
        • Error from setpoint calculation
        • High, low, and zero-crossing compare, with interrupt capability
        • Trigger-to-sample delay capture
    • Eight windowed comparators with 12-bit Digital-to-Analog Converter (DAC) references
    • Three 12-bit buffered DAC outputs
  • Enhanced control peripherals
    • 24 PWM channels with enhanced features
    • 16 High-Resolution Pulse Width Modulator (HRPWM) channels
      • High resolution on both A and B channels of 8 PWM modules
      • Dead-band support (on both standard and high resolution)
    • Six Enhanced Capture (eCAP) modules
    • Three Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Eight Sigma-Delta Filter Module (SDFM) input channels, 2 parallel filters per channel
      • Standard SDFM data filtering
      • Comparator filter for fast action for out of range
  • Configurable Logic Block (CLB)
    • Augments existing peripheral capability
    • Supports position manager solutions
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 system design up to ASIL D; IEC 61508 up to SIL 3; IEC 60730 up to Class C; and UL 1998 up to Class 2
    • Hardware integrity up to ASIL B, SIL 2
  • Safety-related certification
  • Package options:
    • Lead-free, green packaging
    • 337-ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT suffix]
    • 176-pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP suffix]
    • 100-pin PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP) [PZP suffix]
  • Hardware Built-in Self Test (HWBIST)
  • Temperature options:
    • T: –40°C to 105°C junction
    • S: –40°C to 125°C junction
    • Q: –40°C to 125°C free-air (AEC Q100 qualification for automotive applications)

TMS320F28374S 的說明

C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F2837xS is a powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; and sensing and signal processing. To accelerate application development, the DigitalPower software development kit (SDK) for C2000 MCUs and the MotorControl software development kit (SDK) for C2000™ MCUs are available.

The real-time control subsystem is based on TI’s 32-bit C28x floating-point CPU, which provides 200MHz of signal processing performance. The C28x CPU is further boosted by the new TMU accelerator, which enables fast execution of algorithms with trigonometric operations common in transforms and torque loop calculations; and the VCU accelerator, which reduces the time for complex math operations common in encoded applications.

The F2837xS microcontroller family features a CLA real-time control coprocessor. The CLA is an independent 32-bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral triggers and executes code concurrently with the main C28x CPU. This parallel processing capability can effectively double the computational performance of a real-time control system. By using the CLA to service time-critical functions, the main C28x CPU is free to perform other tasks, such as communications and diagnostics.

The TMS320F2837xS supports up to 1MB (512KW) of onboard flash memory with error correction code (ECC) and up to 164KB (82KW) of SRAM. Two 128-bit secure zones are also available on the CPU for code protection.

Performance analog and control peripherals are also integrated on the F2837xS MCU to further enable system consolidation. Four independent 16-bit ADCs provide precise and efficient management of multiple analog signals, which ultimately boosts system throughput. The new sigma-delta filter module (SDFM) works in conjunction with the sigma-delta modulator to enable isolated current shunt measurements. The Comparator Subsystem (CMPSS) with windowed comparators allows for protection of power stages when current limit conditions are exceeded or not met. Other analog and control peripherals include DACs, PWMs, eCAPs, eQEPs, and other peripherals.

Peripherals such as EMIFs, CAN modules (ISO 11898-1/CAN 2.0B-compliant), and a new uPP interface extend the connectivity of the F2837xS. The uPP interface is a new feature of the C2000™ MCUs and supports high-speed parallel connection to FPGAs or other processors with similar uPP interfaces. Lastly, a USB 2.0 port with MAC and PHY lets users easily add universal serial bus (USB) connectivity to their application.

Want to learn more about features that make C2000 MCUs the right choice for your real-time control system? Check out The Essential Guide for Developing With C2000™ Real-Time Microcontrollers and visit the C2000™ real-time control MCUs page.

The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered.

Ready to get started? Check out the TMDSCNCD28379D or LAUNCHXL-F28379D evaluation board sand download C2000Ware.

To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解