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TPS735-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Input voltage: 2.7 V to 6.5 V
- 500-mA low-dropout regulator with EN
- Low IQ: 46 µA
- Multiple output voltage versions available:
- Fixed outputs of 1 V to 4.3 V
- Adjustable outputs from 1.25 V to 6 V
- High PSRR: 68 dB at 1 kHz
- Low noise: 13.2 µVRMS
- Fast startup time: 45 µs
- Stable with a low-ESR, 2-µF output capacitor
- Excellent load and line transient response
- 2% overall accuracy
(load, line, temperature, VOUT > 2.2 V) - Low dropout: 280 mV at 500 mA
- 3-mm × 3-mm VSON-8 packages
The TPS735-Q1 family of low-dropout (LDO), low-power linear regulators offers excellent ac performance with very low ground current. High power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient responses are provided while consuming a very low 46 µA (typical) ground current.
The TPS735-Q1 family of devices is stable with ceramic capacitors and uses an advanced BiCMOS fabrication process to yield a typical dropout voltage of 280 mV at 500-mA output. The TPS735-Q1 family of devices uses a precision voltage reference and feedback loop to achieve overall accuracy of 2% (VOUT > 2.2 V) over all load, line, process, and temperature variations. This family of devices is fully specified from TA = –40°C to 125°C and is offered in a low-profile, 3-mm × 3-mm VSON package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPS735-Q1 500-mA, low quiescent current, low-noise, high PSRR, low-dropout linear regulator datasheet (Rev. B) | PDF | HTML | 2019年 2月 4日 |
| Functional safety information | TPS735-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | 2024年 7月 31日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VSON (DRB) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。