封裝資訊
| 封裝 | 引腳 uSiP (SIP) | 9 |
| 作業溫度範圍 (°C) -40 to 85 |
| 包裝數量 | 運送包裝 250 | SMALL T&R |
TPS82740B 的特色
- 360-nA Typical Quiescent Current
- Up to 90% Efficiency at 10-µA Output Current
- Pin-Selectable Output Voltages in 100-mV Steps
- Integrated Slew Rate Controlled Load Switch
- Up to 200-mA Output Current
- Input Voltage Range VIN from 2.2 V to 5.5 V
- RF Friendly DCS-Control™
- Low Output Voltage Ripple
- Automatic Transition to No Ripple 100% Mode
- Discharge Function on VOUT and LOAD
- Sub 1.1-mm Profile Solution
- Total Solution Size < 6.7mm2
- Small 2.3 mm × 2.9 mm MicroSIP™ Package
TPS82740B 的說明
The TPS82740 is the industry’s first step-down converter module featuring typically 360-nA quiescent current consumption. It is a complete MicroSIPTM DC/DC step-down power solution intended for ultra low-power applications. The module includes the switching regulator, inductor and input/output capacitors. The integration of all required passive components enables a tiny solution size of only 6.7 mm2.
This new DCS-Control™ based device extends the light load efficiency range below 10-µA load currents. It supports output currents up to 200 mA.
The device operates from rechargeable Li-Ion batteries, Li-primary battery chemistries such as Li-SOCl2, Li-MnO2 and two or three cell alkaline batteries. The input voltage range up to 5.5 V also allows operation from an USB port and thin-film solar modules.
The output voltage is user selectable by three voltage select pins (VSEL), within a range from 1.8 V to 2.5 V (TPS82740A) and 2.6 V to 3.3 V (TPS82740B) in 100-mV steps. The TPS82740 features low output voltage ripple and low noise. Once the battery voltage comes close to the output voltage (close to 100% duty cycle), the device enters no ripple 100% mode operation preventing an increase of output voltage ripple. In this case the device stops switching and the output is connected to the input voltage.
The integrated slew rate controlled load switch with a typical ON-resistance of 0.6Ω distributes the selected output voltage to a temporarily used sub-system.
The TPS82740 is available in a small 9-bump 6.7 mm2 MicroSiP™ package.