TPS84620
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
1.2 V to 5.5 V, with 1% Reference Accuracy - Optional Split Power Rail allows
Input Voltage Down to 1.7 V - Adjustable Switching Frequency
(480 kHz to 780 kHz) - Synchronizes to an External Clock
- Adjustable Slow Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Pre-bias Output Start-up
- Operating Temperature Range: –40°C to +85°C
- Enhanced Thermal Performance: 13°C/W
- Meets EN55022 Class B Emissions
- For Design Help Including SwitcherPro™ visit http://www.ti.com/tps84620
The TPS84620RUQ is an easy-to-use integrated power solution that combines a 6-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.
The TPS84620 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPS84620 4.5-V to 14.5-V Input, 6-A Synchronous Buck, Integrated Power Solution datasheet (Rev. F) | 2018年 4月 10日 | |
| Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 2023年 12月 6日 | |
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020年 3月 5日 | ||
| Application note | AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A) | 2013年 4月 23日 | ||
| Application note | Powering TPS84k Devices from 3.3 V | 2013年 1月 4日 | ||
| More literature | TPS84k Integrated Power Modules Info Card (Rev. A) | 2012年 8月 28日 | ||
| User guide | TPS84620EVM-692 6-A, Integrated Power Solution EVM (Rev. A) | 2011年 8月 24日 | ||
| More literature | SEM1600 Topic 4: Constructing Your Power Supply – Layout Considerations | 2005年 7月 12日 | ||
| Application note | AN-643 EMI/RFI Board Design (Rev. B) | 2004年 5月 3日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| B1QFN (RUQ) | 47 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。