UCC3808A-1

現行

具有放電電晶體、12.5/8.3V UVLO、0°C 至 70°C 的低功耗電流模式推挽 PWM

產品詳細資料

Vin (max) (V) 14 Operating temperature range (°C) 0 to 70 Control mode Current Topology Push pull Rating Catalog Duty cycle (max) (%) 49
Vin (max) (V) 14 Operating temperature range (°C) 0 to 70 Control mode Current Topology Push pull Rating Catalog Duty cycle (max) (%) 49
SOIC (D) 8 29.4 mm² 4.9 x 6
  • Dual-Output Drive Stages in Push-Pull Configuration
  • Current-Sense Discharge Transistor to Improve Dynamic Response
  • 130-µA Typical Starting Current
  • 1-mA Typical Run Current
  • Operation to 1 MHz
  • Internal Soft Start
  • On-Chip Error Amplifier With 2-MHz Gain Bandwidth Product
  • On-Chip VDD Clamping
  • Output Drive Stages Capable of 500-mA Peak-Source Current, 1-A Peak-Sink Current
  • Dual-Output Drive Stages in Push-Pull Configuration
  • Current-Sense Discharge Transistor to Improve Dynamic Response
  • 130-µA Typical Starting Current
  • 1-mA Typical Run Current
  • Operation to 1 MHz
  • Internal Soft Start
  • On-Chip Error Amplifier With 2-MHz Gain Bandwidth Product
  • On-Chip VDD Clamping
  • Output Drive Stages Capable of 500-mA Peak-Source Current, 1-A Peak-Sink Current

The UCCx808A devices are a family of BiCMOS push-pull, high-speed, low-power, pulse-width modulators. The UCCx808A contains all of the control and drive circuitry required for off-line or DC-to-DC fixed frequency current-mode switching power supplies with minimal external parts count.

The UCCx808A dual-output drive stages are arranged in a push-pull configuration. Both outputs switch at half the oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 60 ns to 200 ns depending on the values of the timing capacitor and resistors, thus limiting each output stage duty cycle to less than 50%.

The UCCx808A family offers a variety of package options, temperature range options, and choice of undervoltage lockout levels. The family has UVLO thresholds and hysteresis options for off-line and battery-powered systems.

The UCCx808A is an enhanced version of the UCC3808 family. The significant difference is that the A versions feature an internal discharge transistor from the CS pin to ground, which is activated each clock cycle during the oscillator dead time. The feature discharges any filter capacitance on the CS pin during each cycle and helps minimize filter capacitor values and current sense delay.

The UCCx808A devices are a family of BiCMOS push-pull, high-speed, low-power, pulse-width modulators. The UCCx808A contains all of the control and drive circuitry required for off-line or DC-to-DC fixed frequency current-mode switching power supplies with minimal external parts count.

The UCCx808A dual-output drive stages are arranged in a push-pull configuration. Both outputs switch at half the oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 60 ns to 200 ns depending on the values of the timing capacitor and resistors, thus limiting each output stage duty cycle to less than 50%.

The UCCx808A family offers a variety of package options, temperature range options, and choice of undervoltage lockout levels. The family has UVLO thresholds and hysteresis options for off-line and battery-powered systems.

The UCCx808A is an enhanced version of the UCC3808 family. The significant difference is that the A versions feature an internal discharge transistor from the CS pin to ground, which is activated each clock cycle during the oscillator dead time. The feature discharges any filter capacitance on the CS pin during each cycle and helps minimize filter capacitor values and current sense delay.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 2
類型 標題 日期
* Data sheet UCCx808A Low-Power Current-Mode Push-Pull PWM datasheet (Rev. F) PDF | HTML 2017年 4月 17日
Application note Current Doubler Rectifier Offers Ripple Current Cancellation 2004年 9月 21日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 引腳 下載
SOIC (D) 8 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片