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WL1831

現行

WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器

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產品規格表

WL1831

現行
產品規格表 立即訂購

產品詳細資料

Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (MBits) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (MBits) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
DSBGA (YFV) 130 22.87520000000000493 mm² 4.640000000000001 x 4.93
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.
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類型 標題 日期
* Data sheet WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 2021年 5月 14日
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 2023年 8月 22日
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 2023年 8月 2日
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022年 10月 20日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 2021年 12月 20日
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 2021年 5月 27日
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 2021年 5月 19日
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 2021年 1月 15日
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 2020年 10月 27日
White paper Charging stations: Toward an EV support infrastructure 2017年 5月 9日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-AM335X — Linux Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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支援產品和硬體

產品
Wi-Fi 產品
WL1807MOD — WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 — WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1837MOD — WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
Arm 式處理器
AM3351 — Sitara 處理器：Arm Cortex-A8、1Gb 乙太網路、顯示 AM3352 — Sitara 處理器：Arm Cortex-A8、1Gb 乙太網路、顯示器、CAN AM3354 — Sitara 處理器：Arm Cortex-A8、3D 圖形、CAN AM3356 — Sitara 處理器：ARM Cortex-A8、PRU-ICSS、CAN AM3357 — Sitara 處理器：ARM Cortex-A8、EtherCAT、PRU-ICSS、CAN AM3358 — Sitara 處理器：ARM Cortex-A8、3D 繪圖、PRU-ICSS、CAN AM3359 — Sitara 處理器：ARM Cortex-A8、EtherCAT、3D、PRU-ICSS、CAN
硬體開發
TMDSICE3359 — AM3359 工業通訊引擎 TMDSSK3358 — AM335x 入門套件 TMDXEVM3358 — AM335x 評估模組
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軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-RT-AM335X — Linux-RT Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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支援產品和硬體

產品
Wi-Fi 產品
WL1807MOD — WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 — WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1837MOD — WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
Arm 式處理器
AM3351 — Sitara 處理器：Arm Cortex-A8、1Gb 乙太網路、顯示 AM3352 — Sitara 處理器：Arm Cortex-A8、1Gb 乙太網路、顯示器、CAN AM3354 — Sitara 處理器：Arm Cortex-A8、3D 圖形、CAN AM3356 — Sitara 處理器：ARM Cortex-A8、PRU-ICSS、CAN AM3357 — Sitara 處理器：ARM Cortex-A8、EtherCAT、PRU-ICSS、CAN AM3358 — Sitara 處理器：ARM Cortex-A8、3D 繪圖、PRU-ICSS、CAN AM3359 — Sitara 處理器：ARM Cortex-A8、EtherCAT、3D、PRU-ICSS、CAN
硬體開發
TMDSICE3359 — AM3359 工業通訊引擎 TMDXEVM3358 — AM335x 評估模組
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軟體開發套件 (SDK)

PROCESSOR-SDK-RTOS-AM335X — TI-RTOS Processor SDK for AM335x and AMIC110 devices (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
WL1807MOD — WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 — WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1837MOD — WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
Arm 式處理器
AM3351 — Sitara 處理器：Arm Cortex-A8、1Gb 乙太網路、顯示 AM3352 — Sitara 處理器：Arm Cortex-A8、1Gb 乙太網路、顯示器、CAN AM3354 — Sitara 處理器：Arm Cortex-A8、3D 圖形、CAN AM3356 — Sitara 處理器：ARM Cortex-A8、PRU-ICSS、CAN AM3357 — Sitara 處理器：ARM Cortex-A8、EtherCAT、PRU-ICSS、CAN AM3358 — Sitara 處理器：ARM Cortex-A8、3D 繪圖、PRU-ICSS、CAN AM3359 — Sitara 處理器：ARM Cortex-A8、EtherCAT、3D、PRU-ICSS、CAN AMIC110 — Sitara 處理器：ARM Cortex-A8、10+ 乙太網路通訊協定
硬體開發
TMDSICE3359 — AM3359 工業通訊引擎 TMDSSK3358 — AM335x 入門套件 TMDXEVM3358 — AM335x 評估模組 TMDXICE110 — AMIC110 工業通訊引擎 (ICE)
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應用軟體及架構

WILINK-BT_WIFI-WIRELESS_TOOLS — 適用於 WL18XX 模組的 WiLink™ 無線工具

此套件包括以下應用程式：
  • WLAN 即時調整工具 (RTTT)
  • Bluetooth® 記錄器
  • WLAN gLogger
  • 連結品質監測器 (LQM)
  • HCITester 工具
    • BTSout
    • BTSTransform
    • ScriptPad

應用程式提供使用主機偵錯及監控 WiLink™ WLAN/Bluetooth/Bluetooth 低耗能韌體、執行 RF 驗證測試、執行法規認證測試的預先測試，以及偵錯硬體與軟體平台整合問題時所需的所有功能。

WLAN 和 Bluetooth 的無線偵錯和校準工具需要四個 UART 連接埠。將這些連接埠驅動至 PC 的最有效方式是使用 UART 至 USB 轉換器。TI 建議使用 (...)

使用指南: PDF | HTML
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應用軟體及架構

WILINK-WIFI_MESH_VISUALIZATION_TOOL — 適用於 WL18XX 模組的 WiLink™ Mesh 視覺化工具

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
使用指南: PDF
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驅動程式或資料庫

TI-BT-STACK-LINUX-ADDON — 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
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驅動程式或資料庫

WILINK8-WIFI-NLCP — WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

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產品
Wi-Fi 產品
WL1801 — WiLink™8 單頻帶工業 Wi-Fi® 收發器 WL1801MOD — WiLink™ 8 單一頻帶 Wi-Fi® 模組 WL1805MOD — WiLink™ 8 單一頻帶、2x2 MIMO Wi-Fi® 模組 WL1807MOD — WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 — WiLink™8 單頻帶工業 Wi-Fi®、藍牙®和低功耗藍牙收發器 WL1831MOD — WiLink™ 8 工業雙頻 Wi-Fi、Bluetooth 和 Bluetooth Smart (低功耗) 模組 WL1835MOD — WiLink ™ 8 單一頻帶組合 2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth Smart 模組 WL1837MOD — WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
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驅動程式或資料庫

WL18XX-BT-SP — 適用於 WL18xx 的 Bluetooth Service Pack

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not (...)

使用指南: PDF
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設計工具

3P-WIRELESS-MODULES — 第三方無線模組搜尋工具

The third party wireless module search tool helps developers to identify products that meet their end equipment specifications and procure production ready wireless modules. The third party module vendors included in the search tool are independent third party companies with expertise in designing (...)
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