TIDA-00794

Thermal Protection Reference Design of IGBT Modules for HEV/EV Traction Inverters

TIDA-00794

Design files

Overview

The TIDA-00794 reference design is a temp sensing solution for IGBT thermal protection in HEV/EV traction inverter system. It monitors the IGBT temperature via the NTC thermistor integrated inside the IGBT module. It provides thermal shut down to the IGBT gate drivers once the NTC thermistor temperature rises above the programmed threshold. The design includes the IGBT isolated gate drivers, isolation to the high voltage, NTC signal conditioning, Load resistor, and I2C interface to the MSP430, which enables the design system to run independently under high power ratings.

Features
  • Designed for Traction Inverters with rated current up to 300A and DC bus voltage up to 400V
  • IGBT half bridge evaluation platform which includes Gate driver, Isolation, NTC signal Conditioning Circuit, Load resistor, and interface to the MCU
  • Push-Pull current boost at the Gate driver which enables 10A source and 10A sink peak gate currents
  • One multi-channel ADC and one isolation IC for conditioning multi NTCs in the Inverter System
  • 8-kV Reinforced Isolation and CMTI greater than 50kV/µs
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUBJ2A.PDF (15166 K)

Reference design overview and verified performance test data

TIDRL80.PDF (1176 K)

Detailed schematic diagram for design layout and components

TIDRL81.PDF (640 K)

Detailed schematic diagram for design layout and components

TIDRL82.PDF (68 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRL83.PDF (66 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRL84.PDF (510 K)

Detailed overview of design layout for component placement

TIDRL85.PDF (265 K)

Detailed overview of design layout for component placement

TIDRL88.ZIP (3257 K)

Files used for 3D models or 2D drawings of IC components

TIDCC19.ZIP (689 K)

Design file that contains information on physical board layer of design PCB

TIDRL86.PDF (3783 K)

PCB layer plot file used for generating PCB design layout

TIDRL87.PDF (1657 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Isolated gate drivers

ISO5852S-Q1Automotive 5.7kVrms 2.5A/5A single-channel isolated gate driver w/split output & active protection

Data sheet: PDF | HTML
Buck converters (integrated switch)

TPS57140-Q1Automotive 3.5V to 42V, 1.5A Buck Converter with Eco-Mode™

Data sheet: PDF | HTML
Digital isolators

ISO7220A-Q1Automotive, dual-channel, 2/0, 1-Mbps digital isolator

Data sheet: PDF
Isolated DC/DC converters & modules

LM5160-Q1Wide Input 65V, 2A Synchronous Buck / Fly-Buck™ Converter

Data sheet: PDF | HTML
Linear & low-dropout (LDO) regulators

TPS763-Q1Automotive 150-mA, 10-V, low-dropout voltage regulator with enable

Data sheet: PDF | HTML
Noninverting buffers & drivers

SN74LVC125A-Q1Automotive four-channel 1.65V-to-3.6V buffers with 3-state outputs

Data sheet: PDF | HTML
Precision ADCs

ADS1015-Q1Automotive 12-bit, 3.3-kSPS, 4-ch, delta-sigma ADC with PGA, oscillator, VREF, comparator and I2C

Data sheet: PDF | HTML

Technical documentation

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Type Title Date
* Design guide Thermal Protection of IGBT Modules for HEV/EV Traction Inverters Design Guide (Rev. A) Sep. 29, 2016
White paper Driving the green revolution in transportation Sep. 23, 2016

Related design resources

Hardware development

DEVELOPMENT KIT
MSP-EXP430F5529LP MSP430F5529 LaunchPad™ development kit for USB

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