Smart Damper Control Reference Design With Pressure, Humidity, and Temperature Sensing


Design files


This reference design is built to enable multiple room comfort control in connected heating, ventilation and air conditioning (HVAC). Sensing temperature, humidity and pressure allows independent monitoring and air-flow adjustment in each zone. This reference design converts a constant air volume (CAV) into a  variable air volume (VAV) system. Collected data can be transmitted wirelessly to the smart thermostat or gateway. Onboard sensors can be employed to allow predictive maintenance, shorten technical troubleshooting time and reduce overall energy consumption. Long battery life allows the smart damper to run for many years without the need to spend time and money on battery replacement.

  • SimpleLink™ software platform
  • Integrated Bluetooth® low energy radio and MCU for smaller form factor
  • Configurable advertisement interval up to four seconds
  • Ultra-low-power consumption
    • Total average current of 30.56 μA (five louver adjustment events per day)
    • 3.7-μA standby current
    • 61-μA/MHz ARM® Cortex®-M3
    • DC/DC converter uses 28 μA of average power (500-ms advertisement interval)
  • Operates on four AA batteries
  • Motor driver has integrated FETs and current sense comparator that enables easy design and small solution size with minimal discretes
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUCA5.PDF (6376 K)

Reference design overview and verified performance test data


Detailed schematic diagram for design layout and components


Complete listing of design components, reference designators, and manufacturers/part numbers


Detailed overview of design layout for component placement


Files used for 3D models or 2D drawings of IC components

TIDCDK0.ZIP (1079 K)

Design file that contains information on physical board layer of design PCB

TIDRRG1.PDF (1191 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

Buck converters (integrated switch)

TPS627453.3V-10V input, 300mA Ultra Low Iq step-down converter with VSEL and input voltage switch

Data sheet: PDF | HTML
ESD protection diodes

TPD1E10B0612-pF, ±5.5V, ±30-kV ESD protection diode in 0402 and SOD-523 package

Data sheet: PDF | HTML
Humidity sensors

HDC1010±2% low-power digital humidity and temperature sensor in WCSP

Data sheet: PDF | HTML
Low-power 2.4-GHz products

CC2650SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML
P-channel MOSFETs

CSD23285F5-12-V, P channel NexFET™ power MOSFET, single LGA 0.8 mm x 1.5 mm, 35 mOhm, gate ESD protection

Data sheet: PDF | HTML
P-channel MOSFETs

CSD25310Q2-20-V, P channel NexFET™ power MOSFET, single SON 2 mm x 2 mm, 23.9 mOhm

Data sheet: PDF | HTML
RGB LED drivers

LP552319 channel RGB / White LED driver with internal program memory and integrated charge Pump - WQFN

Data sheet: PDF | HTML

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Technical documentation

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Type Title Date
* Design guide Smart Damper Control Ref Design With Pressure, Humidity, and Temperature Sensing Jun. 19, 2016
Technical article Power topology choices for power-hungry devices PDF | HTML Aug. 09, 2017

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