TIDA-060024

Ultrasonic proximity-sensing module (PSM) reference design

TIDA-060024

Design files

Overview

This reference design is a small-form factor solution showcasing double-sided PCB spacing and minimum supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This module operates in a mono-static mode for single sensor transmit and receive operation to enable object detection through air at a range of 0.3 to 5m. Regardless of ambient temperature, humidity, and target color/transparency, object detection remains unaffected; however, maximum range can be hindered by very small or soft targets. The PGA460 operates exclusively as a slave device, and requires a separate master controller. TI recommends using the MSPEXP430F5529LP as an example master controller to repurpose the existing PGA460Q1EVM GUI and example source code.

Features
  • Integrated driver and receiver solution for ultrasonic sensing
  • Compatible with ultrasonic transducers operating at a center frequency between 30-80kHz and 180-480kHz
  • Able to generate maximum sound pressure level using a transformer driver
  • Access to all communication interfaces offered by the PGA460-Q1, including: USART (UART and SPI), TCI, and One-Wire UART
  • Record time for object detection up to 11-m in air
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Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUEK5.PDF (1256 K)

Reference design overview and verified performance test data

TIDM107.PDF (118 K)

Detailed schematic diagram for design layout and components

TIDM108.PDF (132 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDM109.PDF (82 K)

Detailed overview of design layout for component placement

TIDM111.ZIP (872 K)

Files used for 3D models or 2D drawings of IC components

TIDCFK8.ZIP (434 K)

Design file that contains information on physical board layer of design PCB

TIDM110.PDF (341 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Ultrasonic sensor AFEs

PGA460Ultrasonic signal processor and transducer driver

Data sheet: PDF | HTML
Ultrasonic sensor AFEs

PGA460-Q1Automotive ultrasonic signal processor and transducer driver

Data sheet: PDF | HTML

Start development

Hardware

Evaluation board

PGA460PSM-EVM

PGA460 ultrasonic proximity-sensing evaluation module

For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460

The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)

User guide: PDF
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Software

Code example or demo

SLAC741 PGA460 Energia Library and Code Example (Version 1.1.0)

Supported products & hardware

Supported products & hardware

Products
Ultrasonic sensor AFEs
PGA460 Ultrasonic signal processor and transducer driver PGA460-Q1 Automotive ultrasonic signal processor and transducer driver
Hardware development
Evaluation board
BOOSTXL-PGA460 PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers PGA460PSM-EVM PGA460 ultrasonic proximity-sensing evaluation module
GUI for evaluation module (EVM)

SLAC739 PGA460-Q1 EVM GUI (Version 1.0.2.0)

Supported products & hardware

Supported products & hardware

Products
Ultrasonic sensor AFEs
PGA460 Ultrasonic signal processor and transducer driver PGA460-Q1 Automotive ultrasonic signal processor and transducer driver
Hardware development
Evaluation board
BOOSTXL-PGA460 PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers PGA460PSM-EVM PGA460 ultrasonic proximity-sensing evaluation module

Technical documentation

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Type Title Date
* Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design Oct. 09, 2018
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML Apr. 07, 2021
Application note PGA460 Software Development Guide (Rev. A) Aug. 22, 2017

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