TMDS64DC01EVM is a prototype evaluation module and is available in limited quantities.
TMDS64DC01EVM
AM64x IO-link and high-speed breakout card
TMDS64DC01EVM
Overview
The AM64x IO-Link and high speed expansion board is an add-on module for the AM64x GP EVM. This board includes eight (8) IO-Link ports and general purpose signal breakout. The Breakout board section provides the test access to all the IO signals included on the High Speed Expansion connector from AM64x EVM.
This design helps build a universal and scalable IO-Link master. This IO link board/breakout board shall have 150 pin HSE connector and 20 pin ADC connector to mate with General Processor EVM board and eight M12 connectors to execute IO-Link functionality.
Features
- Provides access to all signals on AM64x GP EVM HSE connector
- x8 M12 IO-Link ports with fault protection
- Precision current monitoring with onboard INA253
- x16 individually addressable LEDs
- Assembled HSE IO-link expansion board
Not included
- AM64x GP EVM (purchase here: https://www.ti.com/tool/TMDS64GPEVM)
- 24 V DC power supply, M12 IO-Link connectors/ cabling
Arm-based processors
Order & start development
Evaluation board
TMDS64DC01EVM — AM243x GP EVM high speed expansion board
Not available on TI.com
Technical documentation
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| Type | Title | Date | ||
|---|---|---|---|---|
| * | User guide | TMDS64DC01EVM User's Guide | PDF | HTML | 26 Oct 2021 |
| Certificate | TMDS64DC01EVM EU RoHS Declaration of Conformity (DoC) | 23 Mar 2021 |
Related design resources
Hardware development
EVALUATION BOARD
Software development
SOFTWARE DEVELOPMENT KIT (SDK)
Support & training
TI E2E™ forums with technical support from TI engineers
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