TMDS64DC01EVM is a prototype evaluation module and is available in limited quantities.
TMDS64DC01EVM
AM64x IO-Link 和高速分接板
TMDS64DC01EVM
概覽
The AM64x IO-Link and high speed expansion board is an add-on module for the AM64x GP EVM. This board includes eight (8) IO-Link ports and general purpose signal breakout. The Breakout board section provides the test access to all the IO signals included on the High Speed Expansion connector from AM64x EVM.
This design helps build a universal and scalable IO-Link master. This IO link board/breakout board shall have 150 pin HSE connector and 20 pin ADC connector to mate with General Processor EVM board and eight M12 connectors to execute IO-Link functionality.
特點
- Provides access to all signals on AM64x GP EVM HSE connector
- x8 M12 IO-Link ports with fault protection
- Precision current monitoring with onboard INA253
- x16 individually addressable LEDs
- Assembled HSE IO-link expansion board
Not included
- AM64x GP EVM (purchase here: https://www.ti.com/tool/TMDS64GPEVM)
- 24 V DC power supply, M12 IO-Link connectors/ cabling
Multimedia & industrial networking SoCs
訂購並開始開發
開發板
TMDS64DC01EVM — AM64x IO-Link 和高速分接板
TMDS64DC01EVM — AM64x IO-Link 和高速分接板
設計工具
SPRR457 — TMDS64DC01EVM Design File Package
支援產品和硬體
SPRR457 — TMDS64DC01EVM Design File Package
版本資訊
The design resource accessed as www.ti.com/lit/zip/sprr457 or www.ti.com/lit/xx/sprr457/sprr457.zip has been migrated to a new user experience at www.ti.com/tool/download/SPRR457. Please update any bookmarks accordingly.
技術文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 2
| 類型 | 標題 | 下載最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 使用指南 | TMDS64DC01EVM User's Guide | PDF | HTML | 2021/10/26 | |||
| 證書 | TMDS64DC01EVM EU RoHS Declaration of Conformity (DoC) | 2021/3/23 |