DLPS013G April   2010  – January 2019 DLP5500

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Window Characteristics
    12. 7.12 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Video Modes
      2. 8.4.2 Structured Light Modes
        1. 8.4.2.1 Static Image Buffer Mode
        2. 8.4.2.2 Real Time Structured Light Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 8.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLP5500 System Interface
  10. 10Power Supply Recommendations
    1. 10.1 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Documentation
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (May 2015) to G Revision

Changes from E Revision (September 2013) to F Revision

  • Added ESD Ratings, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed Incorrect VCC2 value from 9V to 8VGo
  • Changed LVDS ƒclock to200 MHz - previously incorrectly listed as 150 MHzGo
  • Added Max Recommended DMD Temperature – Derating CurveGo
  • Added LVCMOS Output Measurement Condition FigureGo
  • Changed Incorrect tC value from 4 ns to 5 ns (200 MHz clock)Go
  • Changed Incorrect tW value from 1.25 ns to 2.5 ns (200 MHz clock)Go
  • Changed SCP Bus DiagramsGo
  • Added LVDS Voltage Definition FigureGo
  • Changed LVDS Waveform Requirements FigureGo
  • Added LVDS Equivalent Input Circuit FigureGo
  • Added LVDS & SCP Rise and Fall Time FiguresGo
  • Moved the Mechanical section from Recommended Operating Conditions table to the System Mounting Interface Loads section Go
  • Added Micromirror Array Physical Characteristics section Go
  • Changed Micromirror Array Physical Characteristics Figure to generic image (M x N)Go
  • Added Micromirror Array Optical Characteristics section Go
  • Changed specular reflectivity wavelength range to 420 - 700 nm (from 400 - 700 nm) to match Recommended Operating ConditionsGo
  • Changed Micromirror Landed Orientation and Tilt Figure to generic image (M x N)Go
  • Added Window Characteristics section Go
  • Added Chipset Component Usage Specification section Go
  • Changed Micromirror Array, Pitch, Hinge Axis Orientation Figure to generic image (M x N)Go
  • Changed Micromirror States: On, Off, Flat Figure to generic DMD imageGo
  • Changed Test Point locations from TC1 & TC2 to TP1 - TP5Go
  • Changed Test Point location Diagram to show TP1 - TP5Go
  • Added Micromirror Landed-on/Landed-Off Duty Cycle sectionGo
  • Changed Typical Application diagramGo
  • Replaced "DAD" with "DLPA200"Go

Changes from D Revision (October 2012) to E Revision

  • Deleted the Device Part Number Nomenclature sectionGo

Changes from C Revision (June 2012) to D Revision

  • Changed the Device Part Number Nomenclature From: DLP5500FYA To: DLP5500AFYAGo
  • Updated Mechanical ICD to V2 with a minor change in the window heightGo

Changes from B Revision (Spetember 2011) to C Revision

  • Added the Package Footprint and Socket information in the Features list Go
  • Deleted redundant information from the DescriptionGo
  • Changed the Illumination power density Max value of <420 mm From: 20 To: 2 mW/cm2Go
  • Changed Storage temperature range and humidity values in Absolute Maximum Ratings Go
  • Added Operating Case Temperature, Operating Humidity, Operating Device Temperature Gradient and Operating Landed Duty-Cycle to RECOMMENDED OPERATING CONDITIONS.Go
  • Added Mirror metal specular reflectivity and Illumination overfill values to "Micromirror Array Optical Characteristics" tableGo
  • Corrected the CL2W, Qarray and Tarray values in Micromirror Array Temperature Calculation for Uniform Illumination.Go
  • Corrected the document reference in Related Documents sectionGo

Changes from A Revision (June 2010) to B Revision

  • Changed the window refractive index NOM spec From: 1.5090 To: 1.5119Go
  • Added table note "At a wavelength of 632.8 nm"Go

Changes from * Revision (April 2010) to A Revision

  • Changed VREF to VCC1Go
  • Added |VID| to the absolute max tableGo
  • Added VMBRST to the absolute max tableGo
  • Clarified Note6 measurement point Go
  • Changed the Illumination power density Max value of <420 mm From: 2 To: 20 mW/cm2Go
  • Added Additional Related DocumentsGo