DLPS095A November   2017  – February 2023 DLP650LE

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Capacitance at Recommended Operating Conditions
    8. 6.8  Timing Requirements
    9. 6.9  Window Characteristics
    10. 6.10 System Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  10. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.12 Micromirror Array Optical Characteristics

Table 6-4 Micromirror Array Optical Characteristics
PARAMETERMINNOMMAXUNIT
Mirror Tilt angle, variation device to device#DLPS08581 #T4989946-28#T4989946-29#DLPS0728306111213degrees
Number of out-of-specification micromirrors#T4589833-6Adjacent micromirrors0micromirrors
Non-adjacent micromirrors10
(1) Measured relative to the plane formed by the overall micromirror array
(2) Variation can occur between any two individual micromirrors located on the same device or located on different devices.
(3) Additional variation exists between the micromirror array and the package datums. See the package drawing.
(4) See #DLPS0728274.
(5) An out-of-specification micromirror is defined as a micromirror that is unable to transition between the two landed states.
Note: This number is specified under conditions described above and deviations from the specified conditions could result in decreased efficiency.
GUID-F52F4D40-8144-41D0-8463-6E4ADFFC8D9A-low.gifFigure 6-9 Micromirror Landed Orientation and Tilt

Refer to GUID-F2939A35-FB9B-45B9-ADD1-AC11F215A958.html#GUID-F2939A35-FB9B-45B9-ADD1-AC11F215A958 table for M, N, and P specifications.