DLPS095A November   2017  – February 2023 DLP650LE

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Capacitance at Recommended Operating Conditions
    8. 6.8  Timing Requirements
    9. 6.9  Window Characteristics
    10. 6.10 System Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  10. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-F8948A02-31C0-4CFA-B0CA-64740695C909-low.gif Figure 5-1 FYL Package149-Pin CLGABottom View
Table 5-1 Pin Functions
PIN NET LENGTH (mils) SIGNAL TYPE(1) DESCRIPTION
NAME NO.
DATA INPUTS
D_AN(1) G20 711.64 LVDS I LVDS pair for Data Bus A
D_AN(3) H19 711.60
D_AN(5) F18 711.60
D_AN(7) E18 711.60
D_AN(9) C20 711.60
D_AN(11) B18 711.60
D_AN(13) A20 711.60
D_AN(15) B19 711.58
D_AP(1) H20 711.66
D_AP(3) G19 711.61
D_AP(5) G18 711.59
D_AP(7) D18 711.60
D_AP(9) D20 711.59
D_AP(11) A18 711.58
D_AP(13) B20 711.59
D_AP(15) A19 711.59
D_BN(1) K20 711.61 LVDS I LVDS pair for Data Bus B
D_BN(3) J19 711.59
D_BN(5) L18 711.59
D_BN(7) M18 711.6
D_BN(9) P20 711.6
D_BN(11) R18 711.59
D_BN(13) T20 711.59
D_BN(15) R19 711.59
D_BP(1) J20 711.61
D_BP(3) K19 711.6
D_BP(5) K18 711.58
D_BP(7) N18 711.58
D_BP(9) N20 711.6
D_BP(11) T18 711.61
D_BP(13) R20 711.59
D_BP(15) T19 711.6
DCLK_AN D19 711.59 I LVDS pair for Data Clock A
DCLK_AP E19 711.59
DCLK_BN N19 711.6 I LVDS pair for Data Clock B
DCLK_BP M19 711.61
DATA CONTROL INPUTS
SCTRL_AN F20 711.62 I LVDS pair for Serial Control (Sync) A
SCTRL_AP E20 711.6
SCTRL_BN L20 711.59 I LVDS pair for Serial Control (Sync) B
SCTRL_BP M20 711.59
MICROMIRROR BIAS RESET INPUTS
MBRST(0) C3 507.20 I Nonlogic compatible Micromirror Bias Reset signals. Connected directly to the array of pixel micromirrors. Used to hold or release the micromirrors. Bond Pads connect to an internal pulldown resistor.
MBRST(1) D2 576.83
MBRST(2) D3 545.78
MBRST(3) E2 636.33
MBRST(4) G3 618.42
MBRST(5) E1 738.25
MBRST(6) G2 718.82
MBRST(7) G1 777.04
MBRST(8) N3 543.29
MBRST(9) M2 612.93
MBRST(10) M3 580.97
MBRST(11) L2 672.43
MBRST(12) J3 653.61
MBRST(13) L1 764.00
MBRST(14) J2 764.37
MBRST(15) J1 813.14
SCP CONTROL
SCPCLK A8 I Serial Communications Port Clock. Bond Pad connects to an internal pulldown circuit.
SCPDI A5 I Serial Communications Port Data. Bond Pad connects to an internal pulldown circuit.
SCPENZ B7 I Active low serial communications port enable. Bond pad connects to an internal pulldown circuit.
SCPDO A9 O Serial communications port output
OTHER SIGNALS
EVCC A3 P Do not connect on the DLP system board.
MODE_A A4 415.1 I Data Bandwidth Mode Select. Bond Pad connects to an internal pulldown circuit. Refer to Table 4 for DLP system board connection information.
PWRDNZ B9 110.38 I Active Low Device Reset. Bond Pad connects to an internal pulldown circuit.
POWER
VCC(2) B11, B12, B13, B16, R12, R13, R16, R17 P Power supply for low voltage CMOS logic. Power supply for normal high voltage at micromirror address electrodes
VCCI(2) A12, A14, A16, T12, T14, T16 P Power supply for low voltage CMOS LVDS interface
VOFFSET(2) C1, D1, M1, N1 P Power supply for high voltage CMOS logic. Power supply for stepped high voltage at micromirror address electrodes
VSS (Ground)(3) A6, A11, A13, A15, A17, B4, B5, B8, B14, B15, B17, C2, C18, C19, F1, F2, F19, H1, H2, H3, H18, J18, K1, K2, L19, N2, P18, P19, R4, R9, R14, R15, T7, T13, T15, T17 P Common Return for all power
RESERVED SIGNALS
RESERVED_FC R7 40.64 I Connect to GND on the DLP system board. Bond Pad connects to an internal pulldown circuit.
RESERVED_FD R8 94.37 I Connect to GND on the DLP system board. Bond Pad connects to an internal pulldown circuit.
RESERVED_PFE T8 50.74 I Connect to ground on the DLP system board. Bond Pad connects to an internal pulldown circuit.
RESERVED_STM B6 I Connect to GND on the DLP system board. Bond Pad connects to an internal pulldown circuit.
RESERVED_TP0 R10 93.3 I Do not connect on the DLP system board.
RESERVED_TP1 T11 263.74 I Do not connect on the DLP system board.
RESERVED_TP2 R11 281.47 I Do not connect on the DLP system board.
RESERVED_BA T10 148.85 O Do not connect on the DLP system board.
RESERVED_BB A10 105.28 O Do not connect on the DLP system board.
RESERVED_RA1 T9 O Do not connect on the DLP system board.
RESERVED_RB1 A7 O Do not connect on the DLP system board.
RESERVED_TS B10 145.42 O Do not connect on the DLP system board.
RESERVED_A(0) T2 NC Do not connect on the DLP system board.
RESERVED_A(1) T3
RESERVED_A(2) R3
RESERVED_A(3) T4
RESERVED_M(0) R2 NC Do not connect on the DLP system board.
RESERVED_M(1) P1 NC Do not connect on the DLP system board.
RESERVED_S(0) T1 NC Do not connect on the DLP system board.
RESERVED_S(1) R1 NC Do not connect on the DLP system board.
RESERVED_IRQZ T6 NC Do not connect on the DLP system board.
RESERVED_OEZ R5 NC Do not connect on the DLP system board.
RESERVED_RSTZ R6 NC Do not connect on the DLP system board.
RESERVED_STR T5 NC Do not connect on the DLP system board.
RESERVED_STR T5 NC Do not connect on the DLP system board.
RESERVED_VB E3, F3, K3, L3 NC Do not connect on the DLP system board.
RESERVED_VR B2, B3, P2, P3 NC Do not connect on the DLP system board.
(1) I = Input, O = Output, G = Ground, A = Analog, P = Power, NC = No Connect.
(2) Power supply pins required for all DMD operating modes are VSS, VBIAS, VCC, VCCI, VOFFSET, and VRESET.
(3) VSS must be connected for proper DMD operation.