SNLS656D August   2020  – December 2023 DP83TD510E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Auto-Negotiation (Speed Selection)
      2. 6.3.2  Repeater Mode
      3. 6.3.3  Media Converter
      4. 6.3.4  Clock Output
      5. 6.3.5  Media Independent Interface (MII)
      6. 6.3.6  Reduced Media Independent Interface (RMII)
      7. 6.3.7  RMII Low Power 5-MHz Mode
      8. 6.3.8  RGMII Interface
      9. 6.3.9  Serial Management Interface
      10. 6.3.10 Extended Register Space Access
        1. 6.3.10.1 Read (No Post Increment) Operation
        2. 6.3.10.2 Read (Post Increment) Operation
        3. 6.3.10.3 Write (No Post Increment) Operation
        4. 6.3.10.4 Write (Post Increment) Operation
      11. 6.3.11 Loopback Modes
        1. 6.3.11.1 MII Loopback
        2. 6.3.11.2 PCS Loopback
        3. 6.3.11.3 Digital Loopback
        4. 6.3.11.4 Analog Loopback
        5. 6.3.11.5 Far-End (Reverse) Loopback
      12. 6.3.12 BIST Configurations
      13. 6.3.13 Cable Diagnostics
        1. 6.3.13.1 TDR
        2. 6.3.13.2 Fast Link Down Functionality
    4. 6.4 Device Functional Modes
      1. 6.4.1 Straps Configuration
        1. 6.4.1.1 Straps for PHY Address
    5. 6.5 Programming
    6. 6.6 MMD Register Address Map
    7. 6.7 DP83TD510E Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Termination Circuit
        1. 7.2.1.1 Termination Circuit for Intrinsic Safe Applications
        2. 7.2.1.2 Components Range for Power Coupling/Decoupling
        3. 7.2.1.3 Termination Circuit for Non-Intrinsic Safe Applications
        4. 7.2.1.4 CMC Specifications
      2. 7.2.2 Design Requirements
        1. 7.2.2.1 Clock Requirements
          1. 7.2.2.1.1 Oscillator
          2. 7.2.2.1.2 Crystal
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Signal Traces
        2. 7.4.1.2 Return Path
        3. 7.4.1.3 Metal Pour
        4. 7.4.1.4 PCB Layer Stacking
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Long cable reach

    • 2000 meters+ with 1-V p2p

    • 2000 meters+ with 2.4-V p2p
  • Ultra-low power
    • 38 mW for 1-V p2p mode
    • 82 mW for 2.4-V p2p mode
  • Compliant to IEEE 802.3cg 10Base-T1L

  • IEC 61000-4-4 EFT ±4 KV at 5 KHz, 100 KHz

  • IEC61000-4-5 surge ±2KV at 1,2/50us, 8/20us

  • IEC 61000-4-2 contact discharge ±4 KV, ±8 KV air discharge

  • CISPR22 radiated emission class B

  • External MDI terminations for intrinsic safety
  • MAC interface:
    • MII mode
    • RMII master/slave mode
    • RGMII mode
    • RMII master low-power 5-MHz mode

    • RMII back-2-back mode for range extender

  • Power supply
    • single supply operations from 3.3 V
    • dual supply operations for lowest power dissipation
  • I/O voltages: 1.8 V, 2.5 V or 3.3 V

  • Diagnostics tool kit

    • Cable open and short detection
    • Signal qualitty indicator (SQI) for cable degradation

    • Active link cable diagnostics (ALCD)

  • Clock output: 25 MHz, 50 MHz (RMII master)
  • ±6-kV HBM ESD protection on MDI pins
  • Operating temperature range: –40°C to 105°C
  • Package: 5 mm x 5 mm, 32 pin with 0.5 mm pitch