SLVSGI9A october   2022  – july 2023 DRV8411A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1.     Pin Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
  9. 8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 External Components
    4. 9.4 Feature Description
      1. 9.4.1 Bridge Control
      2. 9.4.2 Current Sense and Regulation
        1. 9.4.2.1 Current Sensing
        2. 9.4.2.2 Current Regulation
      3. 9.4.3 Protection Circuits
        1. 9.4.3.1 Overcurrent Protection (OCP)
        2. 9.4.3.2 Thermal Shutdown (TSD)
        3. 9.4.3.3 Undervoltage Lockout (UVLO)
    5. 9.5 Device Functional Modes
      1. 9.5.1 Active Mode
      2. 9.5.2 Low-Power Sleep Mode
      3. 9.5.3 Fault Mode
    6. 9.6 Pin Diagrams
      1. 9.6.1 Logic-Level Inputs
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Stepper Motor Application
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
            1. 10.1.1.1.2.1 Stepper Motor Speed
            2. 10.1.1.1.2.2 Current Regulation
            3. 10.1.1.1.2.3 Stepping Modes
              1. 10.1.1.1.2.3.1 Full-Stepping Operation
              2. 10.1.1.1.2.3.2 Half-Stepping Operation with Fast Decay
              3. 10.1.1.1.2.3.3 Half-Stepping Operation with Slow Decay
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 Dual BDC Motor Application
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
            1. 10.1.1.2.2.1 Motor Voltage
            2. 10.1.1.2.2.2 Current Regulation
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Thermal Considerations
          1. 10.1.1.3.1 Maximum Output Current
          2. 10.1.1.3.2 Power Dissipation
          3. 10.1.1.3.3 Thermal Performance
            1. 10.1.1.3.3.1 Steady-State Thermal Performance
            2. 10.1.1.3.3.2 Transient Thermal Performance
  12. 11Power Supply Recommendations
    1. 11.1 Bulk Capacitance
    2. 11.2 Power Supply and Logic Sequencing
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|16
  • RTE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply pin voltage VM -0.5 12 V
Power supply transient voltage ramp VM 0 2 V/µs
Voltage difference between ground pins GND, PGNDA, PGNDB -0.6 0.6 V
Logic pin voltage AIN1, AIN2, BIN1, BIN2 -0.3 5.75 V
Open-drain output pin voltage nFAULT 0.3 5.75 V
Proportional current output pin voltage, VM  ≥ 5.45 V AIPROPI, BIPROPI -0.3 5.75 V
Proportional current output pin voltage, VM  < 5.45 V -0.3 VVM + 0.3 V
Reference input pin voltage VREF 0.3 5.75 V
Output pin voltage AOUT1, AOUT2, BOUT1, BOUT2 -VSD VVM+VSD V
Output current AOUT1, AOUT2, BOUT1, BOUT2 Internally Limited Internally Limited A
Ambient temperature, TA –40 125 °C
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.