SLPS730B august   2021  – august 2023 JFE2140

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 AC Measurement Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precision Matching
      2. 8.3.2 Ultra-Low Noise
      3. 8.3.3 Low Gate Current
      4. 8.3.4 Input Protection
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Protection Diodes
      2. 9.1.2 Cascode Configuration
      3. 9.1.3 Common-Source Amplifier
      4. 9.1.4 Composite Amplifiers
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Noise, Low-Power, High-Input-Impedance Composite Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Differential Front-End Design
        1. 9.2.2.1 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
        2. 10.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 10.1.1.3 TI Reference Designs
        4. 10.1.1.4 Filter Design Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 D Package, 8-Pin SOIC (Top View)
Figure 5-2 DSG Package, 8-Pin WSON (Top View)
Table 5-1 Pin Functions
PINTYPEDESCRIPTION
NAMENO.
D1 2 Output

Drain, channel 1
D26Output

Drain, channel 2

G1 4 Input Gate, channel 1
G28InputGate, channel 2
S1 1 Output Source, channel 1
S25OutputSource, channel 2
VCH3—Positive diode clamp voltage. Float this pin if clamp diodes are not used.
VCL7—Negative diode clamp voltage. Float this pin if clamp diodes are not used.
Thermal Pad Thermal Pad — Exposed thermal pad. This pad is internally connected to the VCL node. Connect this pad to the same node as VCL or leave floating.