SLPS730B august   2021  – august 2023 JFE2140

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 AC Measurement Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precision Matching
      2. 8.3.2 Ultra-Low Noise
      3. 8.3.3 Low Gate Current
      4. 8.3.4 Input Protection
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Protection Diodes
      2. 9.1.2 Cascode Configuration
      3. 9.1.3 Common-Source Amplifier
      4. 9.1.4 Composite Amplifiers
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Noise, Low-Power, High-Input-Impedance Composite Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Differential Front-End Design
        1. 9.2.2.1 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
        2. 10.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 10.1.1.3 TI Reference Designs
        4. 10.1.1.4 Filter Design Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision A (March 2022) to Revision B (August 2023)

  • Changed DSG (WSON, 8) package status from preview to production data (active)Go
  • Changed parameter descriptions from "gate-to-source voltage" to "gate-to-source breakdown voltage" and from "drain-to-source voltage" to "drain-to-source breakdown voltage" in Device Summary table to match Electrical Characteristics. Go
  • Added "max" to parameter description "differential gate-to-source voltage matching" in Device Summary table.Go
  • Added values for DSG (WSON, 8) package to Thermal Information table Go
  • Added condition "VDS = 5 V" to Figure 6-7, Gate Current vs Gate-to-Source Voltage Go
  • Added clarification that the threshold voltage is equivalent to the gate-to-source cutoff voltage (VGSC) in Common-Source Amplifier. Go
  • Added JFE2140EVM user's guide and JFE2140 Ultra-Low-Noise Preamplifier application note to Related Documentation.Go

Changes from Revision * (August 2021) to Revision A (March 2022)

  • Changed ESD JEDEC specification to JS-002 Go
  • Changed gate-to-source voltages from –1.2 V to  –1.3 V (100 µA), –0.9 V to –1.1 V (2 mA) Go
  • Changed Y-axis range from 0 to 33 to 0 to 16 on Figure 6-1, Drain-to-Source Current vs Gate-to-Source Voltage Go