SNLS474E February   2015  – June 2018 LMH1218

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified SPI Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions – SPI Mode/ Mode_SEL = 1 kΩ to VDD
    2.     Pin Descriptions – SMBUS Mode/ MODE_SEL = 1 kΩ to GND
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Loss of Signal Detector
      2. 7.3.2 Continuous Time Linear Equalizer (CTLE)
      3. 7.3.3 2:1 Multiplexer
      4. 7.3.4 Clock and Data Recovery
      5. 7.3.5 Eye Opening Monitor (EOM)
      6. 7.3.6 Fast EOM
        1. 7.3.6.1 SMBus Fast EOM Operation
        2. 7.3.6.2 SPI Fast EOM Operation
      7. 7.3.7 LMH1218 Device Configuration
        1. 7.3.7.1 MODE_SEL
        2. 7.3.7.2 ENABLE
        3. 7.3.7.3 LOS_INT_N
        4. 7.3.7.4 LOCK
        5. 7.3.7.5 SMBus MODE
        6. 7.3.7.6 SMBus READ/WRITE Transaction
        7. 7.3.7.7 SPI Mode
          1. 7.3.7.7.1 SPI READ/WRITE Transaction
          2. 7.3.7.7.2 SPI Write Transaction Format
          3. 7.3.7.7.3 SPI Read Transaction Format
        8. 7.3.7.8 SPI Daisy Chain
          1. 7.3.7.8.1 SPI Daisy Chain Write Example
          2. 7.3.7.8.2 SPI Daisy Chain Write Read Example
            1. 7.3.7.8.2.1 SPI Daisy Chain Length of Daisy Chain Illustration
      8. 7.3.8 Power-On Reset
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 Global Registers
      2. 7.6.2 Receiver Registers
      3. 7.6.3 CDR Registers
      4. 7.6.4 Transmitter Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for All Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Initialization Set Up
      1. 8.4.1 Selective Data Rate Lock
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Solder Profile
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

Typical device characteristics at TA = +25°C and VDD = 2.5 V, unless otherwise noted.
LMH1218 output1_totaljitter_8point6.png
Figure 1. 11.88 Gbps 50 Ω OUT1
LMH1218 output01188gbps_totaljitter26point4.png
Figure 3. 11.88 Gbps 75 Ω OUT0
LMH1218 2point97_gbps_output1_totaljitter21point4.png
Figure 5. 2.97 Gbps 75 Ω OUT0
LMH1218 eye_diagram_green_lmh1218.gif
Figure 7. Internal Input Eye Monitor Plot
LMH1218 output1_totaljitter_ninepointthree.png
Figure 2. 10.3125 Gbps 50 Ω OUT1
LMH1218 output0_5point94_gbps_total_jitter19point1.png
Figure 4. 5.94 Gbps 75 Ω OUT0
LMH1218 output1_totaljitter_thirtyeight_point_two.png
Figure 6. 1.485 Gbps 75 Ω OUT0
LMH1218 eye_diagram_eye_hit_density.gif
Figure 8. 11.88 Gbps Internal Eye Monitor Hit Density Plot