SNCS103E November   2004  – August 2018 LMH6574

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Frequency Response vs VOUT
      2.      Frequency Response vs Gain
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Truth Table
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics ±5 V
    6. 6.6 Electrical Characteristics ±3.3 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 Video Performance
      2. 7.2.2 Feedback Resistor Selection
      3. 7.2.3 Other Applications
      4. 7.2.4 Driving Capacitive Loads
      5. 7.2.5 ESD Protection
    3. 7.3 Device Functional Modes
      1. 7.3.1 SD vs EN
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multiplexer Expansion
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Power Dissipation

The LMH6574 is optimized for maximum speed and performance in the small form factor of the standard SOIC package. To ensure maximum output drive and highest performance, thermal shutdown is not provided. Therefore, it is of utmost importance to make sure that the TJMAX is never exceeded due to the overall power dissipation.

Follow these steps to determine the Maximum power dissipation for the LMH6574:

  1. Calculate the quiescent (no-load) power.
    2. Equation 1. PAMP = ICC* (VS)

    where

    • VS = V+ - V−
  2. Calculate the RMS power dissipated in the output stage:
    3. Equation 2. PD (rms) = rms ((VS - VOUT) * IOUT)

    where

    • VOUT is the voltage across the external load
    • IOUT is the current through the external load
    • VS is the total supply voltage
  3. Calculate the total RMS power: PT = PAMP + PD.

The maximum power that the LMH6574 package can dissipate at a given temperature can be derived with the following equation:

Equation 3. PMAX = (150° – TAMB)/RθJA

where

  • TAMB = Ambient temperature (°C)
  • RθJA = Thermal resistance, from junction to ambient, for a given package (°C/W)

For the SOIC package RθJA is 130 °C/W.