SNCS103E November   2004  – August 2018 LMH6574

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Frequency Response vs VOUT
      2.      Frequency Response vs Gain
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Truth Table
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics ±5 V
    6. 6.6 Electrical Characteristics ±3.3 V
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 Video Performance
      2. 7.2.2 Feedback Resistor Selection
      3. 7.2.3 Other Applications
      4. 7.2.4 Driving Capacitive Loads
      5. 7.2.5 ESD Protection
    3. 7.3 Device Functional Modes
      1. 7.3.1 SD vs EN
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multiplexer Expansion
  9. Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from D Revision (December 2014) to E Revision

  • Changed IBN parameter maximum specifications from ±5 µA to ±5.2 µA and from ±5.6 µA to ±5.8 µAGo
  • Changed PSRR parameter minimum specifications from 47 dB to 43 dB and from 45 dB to 41 dBGo
  • Changed Supply Current Disabled parameter maximum specifications from 5.8 mA to 6.2 mA and from 5.9 mA to 6.3 mAGo
  • Changed IiL parameter minimum specifications from –2.9 µA to –3.3 µA and from –8.5 µA to –9 µAGo
  • Added Feature Description and Device Functional Modes sectionsGo

Changes from C Revision (November 2012) to D Revision

  • Added, updated, or revised the following sections: Pin Configuration and Functions, Specifications, Application and Implementation, Power Supply Recommendations , Layout , Device and Documentation Support , and Mechanical, Packaging, and Orderable InformationGo
  • Revised text in Application and Implementation section, formerly titled "Application Notes"Go
  • Revised text in Multiplexer Expansion section. Added Figure 31, Figure 32, and Figure 33Go