SNVSC74 September   2023 LP5813

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  9. Typical Characteristics
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Synchronous Boost Converter
        1. 9.3.1.1 Undervoltage Lockout
        2. 9.3.1.2 Enable and Soft Start
        3. 9.3.1.3 Switching Frequency
        4. 9.3.1.4 Current Limit Operation
        5. 9.3.1.5 Boost PWM Mode
        6. 9.3.1.6 Boost PFM Mode
        7. 9.3.1.7 Pass-Through Mode
      2. 9.3.2 Time-cross-multiplexing (TCM) scheme
        1. 9.3.2.1 Direct drive mode
        2. 9.3.2.2 TCM drive mode
        3. 9.3.2.3 Mix drive mode
        4. 9.3.2.4 Ghosting elimination
      3. 9.3.3 Analog Dimming
      4. 9.3.4 PWM Dimming
      5. 9.3.5 Autonomous Animation Engine Control
        1. 9.3.5.1 Animation Engine Pattern
        2. 9.3.5.2 Sloper
        3. 9.3.5.3 Animation Engine Unit (AEU)
        4. 9.3.5.4 Animation Pause Unit (APU)
      6. 9.3.6 Protections and Diagnostics
        1. 9.3.6.1 Overvoltage Protection
        2. 9.3.6.2 Output Short-to-Ground Protection
        3. 9.3.6.3 LED Open Detections
        4. 9.3.6.4 LED Short Detections
        5. 9.3.6.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
    6. 9.6 Register Map Table
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Inductor Selection
        2. 10.2.3.2 Output Capacitor Selection
        3. 10.2.3.3 Input Capacitor Selection
        4. 10.2.3.4 Program Procedure
        5. 10.2.3.5 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mix drive mode

The mix drive mode can drive LEDs separately by direct-drive and TCM-drive in the same time. The mix drive mode is configured by setting led_mode = 5h/6h/7h for 1/2/3 scans. After setting the scan count, scan_order_x (x = 1, 2, 3, 4) needs to be written for the scan orders. Then the direct drive LEDs need to be configured by mix_sel_led in Dev_Config_1 register. To control the LEDs, LED_x (x = 0, 1, 2, 3) in the register map is for the direct drive LEDs, while LED_xy (x = A, B, C, D; y = 0, 1, 2) is for the TCM drive LEDs.

The typical application diagrams are illustrated as Figure 9-9 (1 scan), Figure 9-10 (2 scans) and Figure 9-11 (3 scans).

GUID-20220620-SS0I-TG69-C7DV-WFSJ71SG5TZX-low.svg Figure 9-9 Mix drive, 1 scan (led_mode = 5h, scan_order_0 = 0h, mix_sel_led = 8h)
GUID-20220620-SS0I-K4TT-LSVJ-SDQQHNQB51ND-low.svg Figure 9-10 Mix drive mode, 2 scans (led_mode = 6h, scan_order_0 = 0h, scan_order_1 = 1h, mix_sel_led = 8h)
GUID-20220620-SS0I-H5MR-CVMQ-9Z04X7K2GWSF-low.svg Figure 9-11 Mix drive mode, 3 scans (led_mode = 7h, scan_order_0 = 0h, scan_order_1 = 1h, scan_order_2 = 2h, mix_sel_led = 8h)